US2007023105A1PendingUtilityA1

CoPtP thin film having very high perpendicular magnetic anisotropy and method for manufacturing the same

Assignee: JEUNG WON-YOUNGPriority: Jul 29, 2005Filed: Dec 29, 2005Published: Feb 1, 2007
Est. expiryJul 29, 2025(expired)· nominal 20-yr term from priority
C25D 3/562C25D 3/56
42
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Claims

Abstract

The present invention relates to a CoPtP thin film having very high perpendicular magnetic anisotropy and a method for manufacturing the same. The method for manufacturing a CoPtP alloy thin film according to the present invention includes the steps of preparing an electroplating solution including CoSO 4 ·7 H 2 O at 0.05˜0.2 M, H 2 PtCl 6 at 0.005˜0.02 M, and NaH 2 PO 2 at 0.01˜0.4 M, and dipping a basic material into the electroplating solution and forming the CoPtP alloy thin film on the basic material by electroplating at a low temperature.

Claims

exact text as granted — not AI-modified
1 . A method for manufacturing a CoPtP alloy thin film comprising the steps of: 
 preparing an electroplating solution comprising CoSO 4 ·7H 2 O at 0.05˜0.2 M, H 2 PtCl 6  at 0.005˜0.02 M, and NaH 2 PO 2  at 0.01˜0.4 M;    dipping a basic material into the electroplating solution; and    forming the CoPtP alloy thin film on the basic material by electroplating at a low temperature.    
   
   
       2 . The method for manufacturing a CoPtP alloy thin film of  claim 1 , wherein the electroplating solution further comprises an ammonium salt at 0.1˜0.5 M in the step of preparing an electroplating solution.  
   
   
       3 . The method for manufacturing a CoPtP alloy thin film of  claim 1 , wherein the electroplating solution further comprises Na 4 P 2 O 7  at 0.3˜0.7 M in the step of preparing an electroplating solution.  
   
   
       4 . The method for manufacturing a CoPtP alloy thin film of  claim 1 , wherein the basic material is made of cobalt in the step of preparing an electroplating solution.  
   
   
       5 . The method for manufacturing a CoPtP alloy thin film of  claim 1 , wherein the electroplating is carried out at a temperature of 30˜55° C. in the step of forming the CoPtP alloy thin film.  
   
   
       6 . A CoPtP alloy thin film manufactured by using the method for manufacturing a CoPtP alloy thin film of  claim 1 .  
   
   
       7 . The CoPtP alloy thin film of  claim 6 , comprising: 
 a plurality of CoPt grains; and    boundary layers surrounding the CoPt grains, and wherein    the boundary layers comprise Pt and P.    
   
   
       8 . The CoPtP alloy thin film of  claim 7 , wherein each of the CoPt grains are separated from each other by the boundary layers.  
   
   
       9 . The CoPtP alloy thin film of  claim 6 , with a coercivity of 4000 Oe˜7000 Oe.  
   
   
       10 . The CoPtP alloy thin film of  claim 6 , with a squareness of not less than 0.7.

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