Copper electrolysis solution for production of electrolytic copper foil and process for producing electrolytic copper foil

Abstract

This invention is for providing a copper electrolyte solution producing an electrolytic copper foil capable of providing a foil in which the shape and size of mountains of the rough surface of the deposited foil are uniform and which has low roughness, substantially without decrease of the yield of deposited foil by controlling the molecular weight and the concentration of protein, etc. and a method of producing an electrolytic copper foil using the same. In this copper electrolyte solution for producing an electrolytic copper foil, protein in the copper electrolyte solution preferably has a number average molecular weight M n of 1000 to 2300 and the copper electrolyte solution preferably has a protein concentration of 2 to 4.5 ppm. The electrolyte solution preferably has Cu 2+ concentration of 60 to 100 g/L. In addition, the electrolyte solution preferably has a free SO 4 2− concentration of 60 to 250 g/L. Also the electrolyte solution preferably has Cl − concentration of 0.5 to 2.0 ppm. The method of producing the electrolytic copper foil employs the copper electrolyte solution therefor.

1 . A copper electrolyte solution for producing an electrolytic copper foil, characterized by comprising protein having a number average molecular weight M n  of 1000 to 2300 at a concentration of 2 ppm to 4.5 ppm.  
   
   
       2 . The copper electrolyte solution for producing an electrolytic copper foil according to  claim 1 , characterized in that a Cu 2+  concentration is 60 g/L to 100 g/L.  
   
   
       3 . The copper electrolyte solution for producing an electrolytic copper foil according to  claim 1 , characterized in that a free SO 4   2−  concentration is 60 g/L to 250 g/L.  
   
   
       4 . The copper electrolyte solution for producing an electrolytic copper foil according to  claim 1 , characterized in that a Cl −  concentration is 0.5 ppm to 2.0 ppm.  
   
   
       5 . The copper electrolyte solution for producing an electrolytic copper foil according to  claim 1 , characterized in that the temperature is 40° C. to 60° C.  
   
   
       6 . A method of producing an electrolytic copper foil, characterized by using the copper electrolyte solution for producing an electrolytic copper foil according to  claim 1 .  
   
   
       7 . A method of producing an electrolytic copper foil, characterized by using the copper electrolyte solution for producing an electrolytic copper foil according to  claim 2 .  
   
   
       8 . A method of producing an electrolytic copper foil, characterized by using the copper electrolyte solution for producing an electrolytic copper foil according to  claim 3 .  
   
   
       9 . A method of producing an electrolytic copper foil, characterized by using the copper electrolyte solution for producing an electrolytic copper foil according to  claim 4 .  
   
   
       10 . A method of producing an electrolytic copper foil, characterized by using the copper electrolyte solution for producing an electrolytic copper foil according to  claim 5 .  
   
   
       11 . The method of producing an electrolytic copper foil according to  claim 6 , characterized in that the current density for electrolysis is 30 A/cm 2  to 70 A/cm 2 .  
   
   
       12 . The method of producing an electrolytic copper foil according to  claim 7 , characterized in that the current density for electrolysis is 30 A/cm 2  to 70 A/cm 2 .  
   
   
       13 . The method of producing an electrolytic copper foil according to  claim 8 , characterized in that the current density for electrolysis is 30 A/cm 2  to 70 A/cm 2 .  
   
   
       14 . The method of producing an electrolytic copper foil according to  claim 9 , characterized in that the current density for electrolysis is 30 A/cm 2  to 70 A/cm 2 .  
   
   
       15 . The method of producing an electrolytic copper foil according to  claim 10 , characterized in that the current density for electrolysis is 30 A/cm 2  to 70 A/cm 2 .