Method for heating components

Abstract

A method is provided for heating components before and/or during a further processing thereof. At least one laser device is used as energy source for heating.

1 - 10 . (canceled)  
   
   
       11 . A method for processing one or more components of gas turbines prior to and/or during further processing of same, comprising heating a component of a gas turbine with at least one laser device.  
   
   
       12 . The method as recited in  claim 11 , wherein the component is irradiated at least on one side by the at least one laser device.  
   
   
       13 . The method as recited in  claim 11 , wherein the at least one laser device includes a first laser device and a second laser device, and wherein the step of heating comprises irradiating the component on two sides from two irradiation directions using laser radiation, the first laser device being used for one irradiation direction and the second laser device being used for the other irradiation direction.  
   
   
       14 . The method as recited in  claim 11 , wherein the at least one laser device includes a plurality of laser devices, and wherein the step of heating comprises irradiating the components on all sides from multiple irradiation directions using laser radiation, one laser device being used for each irradiation direction.  
   
   
       15 . The method as recited in  claim 11 , further comprising adjusting angles of incidence at which laser radiation hit a surface of the component to the contour of said surface.  
   
   
       16 . The method as recited in  claim 14 , further comprising adjusting angles of incidence at which laser radiation from the plurality of laser devices hit a plurality of surfaces of the component to the contour of each surface.  
   
   
       17 . The method as recited in  claim 11 , further comprising measuring a temperature of the component, and, as a function thereof, adjusting such the power of the laser device to achieve an intended temperature setpoint value.  
   
   
       18 . The method as recited in  claim 14 , further comprising measuring a temperature of the component, and, as a function thereof, adjusting such the power of each laser device to achieve an intended temperature setpoint value.  
   
   
       19 . The method as recited in  claim 17 , wherein the heating and measuring steps are performed without contacting the component.  
   
   
       20 . The method as recited in  claim 11 , wherein one or multiple diode laser(s) are used as the at least one laser device.  
   
   
       21 . The method as recited in  claim 11 , further comprising subjecting the component to further processing after or during heating.  
   
   
       22 . The method as recited in  claim 19 , wherein the further processing comprises laser hardfacing the component with a separate laser device.