Semiconductor wafer treating apparatus

Abstract

A semiconductor wafer treating apparatus comprising a housing, holding means rotatably disposed within the housing, rotating means for rotating the holding means, and cleaning means for cleaning a semiconductor wafer held on the holding means. Irradiation means for irradiating the semiconductor wafer held on the holding means with short wavelength ultraviolet radiation is further disposed in the semiconductor wafer treating apparatus.

1 . A semiconductor wafer treating apparatus comprising a housing, holding means rotatably disposed within the housing, rotating means for rotating the holding means, and cleaning means for cleaning a semiconductor wafer held on the holding means, further comprising: 
 irradiation means disposed for irradiating the semiconductor wafer held on the holding means with short wavelength ultraviolet radiation.    
     
     
         2 . The semiconductor wafer treating apparatus according to  claim 1 , wherein 
 a part of the housing is defined by a shutter member movable between a closing position and an opening position,    when the shutter member is located at the closing position, the housing is substantially closed, and when the shutter member is located at the opening position, an opening is formed in the housing, and    the semiconductor wafer can be carried into and carried out of the housing through the opening.    
     
     
         3 . The semiconductor wafer treating apparatus according to  claim 1 , wherein 
 the holding means is mounted to be rotatable about a central axis extending substantially vertically, and has a substantially horizontal holding upper surface,    the cleaning means includes cleaning fluid jetting means and drying gas jetting means, and    the cleaning fluid jetting means and the drying gas jetting means are selectively located at an operating position where a jetting end portion of each of the cleaning fluid jetting means and the drying gas jetting means opposes and stays above the holding upper surface of the holding means, and a non-operating position where the jetting end portion recedes from the holding upper surface of the holding means.    
     
     
         4 . The semiconductor wafer treating apparatus according to  claim 1 , wherein 
 the irradiation means includes an irradiation unit having short wavelength ultraviolet radiation irradiation lamps, and    the irradiation unit is selectively located at an operating position where the irradiation unit opposes and stays above a holding upper surface of the holding means within the housing, and a non-operating position where the irradiation unit is located outside the housing.    
     
     
         5 . The semiconductor wafer treating apparatus according to  claim 4 , wherein 
 the irradiation means includes a support member mounted with the irradiation unit,    the support member and the irradiation unit mounted on the support member are moved through an additional opening formed in a wall of the housing, whereby the irradiation unit is selectively located at the operating position and the non-operating position, and    the support member has a first closing portion for substantially closing the additional opening when the irradiation unit is located at the operating position, and a second closing portion for substantially closing the additional opening when the irradiation unit is located at the non-operating position.