Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor

Abstract

Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor are provided. One aspect of the invention provides a semiconductor processor system including a process chamber adapted to process at least one semiconductor workpiece using a process fluid; a connection coupled with the process chamber and configured to receive the process fluid; a sensor coupled with the connection and configured to output a signal indicative of the process fluid; and a control system coupled with the sensor and configured to control at least one operation of the semiconductor processor system responsive to the signal.

1 . A semiconductor processor system comprising: 
 a process chamber adapted to process at least one semiconductor workpiece using a process fluid;    a connection coupled with the process chamber and configured to receive the process fluid;    a sensor coupled with the connection and configured to output a signal indicative of the process fluid; and    a control system coupled with the sensor and configured to control at least one operation of the semiconductor processor system responsive to the signal.    
   
   
       2 . The system according to  claim 1  wherein the connection comprises a connection of a sampling system configured to provide the process fluid in a substantially static state.  
   
   
       3 . The system according to  claim 2  wherein the control system is configured to compare the substantially static process fluid with a signature to determine at least one characteristic of the process fluid.  
   
   
       4 . The system according to  claim 3  wherein the control system is configured to control a flow rate of the process fluid into the process chamber responsive to the comparison.  
   
   
       5 . The system according to  claim 4  wherein the control system is configured to halt processing within the process chamber responsive to the comparison.  
   
   
       6 . The system according to  claim 1  wherein the sensor is configured to monitor turbidity of the process fluid.  
   
   
       7 . The system according to  claim 1  wherein the connection is adapted to couple with a process fluid supply and is configured to supply process fluid from the process fluid supply to the process chamber.  
   
   
       8 . The system according to  claim 1  wherein the connection comprises a drain coupled with the process chamber.  
   
   
       9 . The system according to  claim 1  wherein the process chamber comprises a pad adapted to process the at least one semiconductor workpiece and the connection is configured to extract process fluid from the pad.  
   
   
       10 . The system according to  claim 1  wherein the sensor is configured to output a signal indicative of accumulation of particulate matter within the connection.  
   
   
       11 . The system according to  claim 1  wherein the control system is configured to process the signal to monitor processing of the at least one semiconductor workpiece within the process chamber.  
   
   
       12 . The system according to  claim 1  further comprising a flush system coupled with the connection and configured to selectively flush the connection.  
   
   
       13 . The system according to  claim 12  wherein the flush system is configured to flush the connection with at least one of the process fluid and a rinse fluid.  
   
   
       14 . The system according to  claim 12  wherein the flush system is configured to flush the connection responsive to control from the control system.  
   
   
       15 . The system according to  claim 1  further comprising a mixing system configured to mix plural components of the process fluid and the control system is configured to control the mixing system.  
   
   
       16 . The system according to  claim 1  further comprising a storage device configured to store historical data corresponding to the process fluid.  
   
   
       17 . The system according to  claim 1  wherein the process chamber comprises a process chamber of a chemical-mechanical polishing processor.  
   
   
       18 . A semiconductor processor system comprising: 
 a process chamber adapted to process at least one semiconductor workpiece using a process fluid;    a connection coupled with the process chamber and configured to transport the process fluid;    a sampling system coupled with the connection and configured to receive a sample of the process fluid;    a sensor coupled with the sampling system and configured to output a signal indicative of the sample of the process fluid; and    a control system coupled with the sensor and configured to control at least one operation of the semiconductor processor system responsive to the signal.    
   
   
       19 . The system according to  claim 18  wherein the sampling system is configured to provide the process fluid in a substantially static state.  
   
   
       20 . The system according to  claim 19  wherein the control system is configured to compare the sample of the process fluid with a signature to determine at least one characteristic of the process fluid.  
   
   
       21 - 129 . (canceled)