US2007012400A1PendingUtilityA1
Bonding method
Est. expiryJul 12, 2025(expired)· nominal 20-yr term from priority
C09J 5/02
50
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Claims
Abstract
A bonding method that enables adhesive protruding out from a joint to be removed easily. A primer 14 is applied onto a part of a region 13 a of a joint 13 between a glass plate 11 and a molding 12 . An adhesive 15 for which adhesion is realized through the primer 14 is applied such as to fill the joint 13 with the adhesive 15.
Claims
exact text as granted — not AI-modified1 . A bonding method comprising:
a primer application step of applying a primer onto a part of a region of a joint between a joined body and an adherend; and an adhesive application step of applying an adhesive for which adhesion is realized through the primer such as to fill the joint with the adhesive.
2 . A bonding method as claimed in claim 1 , further having an adhesive thinning step of reducing a thickness of the applied adhesive at a parting portion of the adherend before the adhesive hardens.
3 . A bonding method as claimed in claim 2 , wherein said adhesive thinning step comprises a parting line formation step of forming a parting line in the applied adhesive.
4 . A bonding method as claimed in claim 2 , further having a tape affixing step of affixing tape to a portion where the adhesive is to be applied away from the joint before the primer is applied onto the part of the region of the joint.
5 . A bonding method as claimed in claim 2 , further having a tape affixing step of affixing tape to a portion where the adhesive is to be applied away from the joint after the primer has been applied onto the part of the region of the joint but before the adhesive is applied.Join the waitlist — get patent alerts
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