Method of manufacturing a device, device, non-contact type card medium, and electronic equipment

Abstract

Wirings 2 B 1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent property, bonding an insulating layer 4 B 1 to the wirings 2 B 1 with an adhesive material 3 B 1 therebetween, peeling and removing the provisional substrate 5 , and bonding and fixing the wirings 2 B 1 together with the insulating film 4 B 1 to a main substrate 1 by an adhesive material 3 B 1.

1 . A method of manufacturing a wiring board, comprising: 
 putting an adhesion film and a functional film together, the adhesion film being formed on a surface of a first substrate, the functional film being formed on a peeling layer of a second substrate;    peeling the functional film from the peeling layer of the second substrate to transfer the functional film to the first substrate, the functional film and the adhesion film forming a flat surface in a flat shape on the first substrate; and    putting the flat surface on the first substrate and one surface of a third substrate together.    
   
   
       2 . A method of manufacturing a wiring board, comprising: 
 putting an insulating film and a functional film together, the insulating film being formed on a surface of a first substrate, the functional film being formed on a peeling layer of a second substrate;    peeling the functional film from the peeling layer of the second substrate to transfer the functional film to the first substrate, the functional film and the insulating film forming a flat surface in a flat shape on the first substrate; and    putting the flat surface on the first substrate and one surface of a third substrate together.    
   
   
       3 . A method of manufacturing a wiring board, comprising: 
 putting an adhesion film and a functional film together, the adhesion film being formed on a surface of an insulating layer, the functional film being formed on a peeling layer of a provisional substrate;    peeling the functional film from the peeling layer of the provisional substrate to transfer the functional film to the insulating layer, the functional film and the adhesion film forming a flat surface in a flat shape on the insulating layer; and    putting the flat surface on the insulating layer and one surface of a main substrate together.    
   
   
       4 . The method of manufacturing a wiring board according to  claim 1 , the functional film being a conductive film.  
   
   
       5 . The method of manufacturing a wiring board according to  claim 1 , the peeling layer being a liquid repellant layer.  
   
   
       6 . The method of manufacturing a wiring board according to  claim 1 , a size of the third substrate being larger than a size of the first substrate.  
   
   
       7 . A method of manufacturing a wiring board, comprising: 
 forming a liquid repellent layer on a second substrate;    discharging a liquid material to the second substrate to form an applied film on the liquid repellent layer;    heating the applied film to form a conductive film;    putting an adhesion film and the conductive film together, the adhesion film being formed on a surface of a first substrate;    peeling the conductive film from the liquid repellent layer of the second substrate to transfer the conductive film to the first substrate, the conductive film and the adhesion film forming a flat surface in a flat shape on the first substrate; and    putting the flat surface on the first substrate and one surface of a third substrate together.    
   
   
       8 . A method of manufacturing a wiring board, comprising: 
 forming a liquid repellent layer on a provisional substrate;    discharging a liquid material to the provisional substrate to form an applied film on the liquid repellent layer;    heating the applied film to form a conductive film;    putting an adhesion film and the conductive film together, the adhesion film being formed on a surface of an insulating layer;    peeling the conductive film from the liquid repellent layer of the provisional substrate to transfer the conductive film to the insulating layer, the conductive film and the adhesion film forming a flat surface in a flat shape on the insulating layer; and    putting the flat surface on the insulating layer and one surface of a main substrate together.    
   
   
       9 . The method of manufacturing a wiring board according to  7 , the liquid material including silver.