Polishing pad and method of producing same

Abstract

The present invention relates to a method of producing a polishing pad, comprising steps of: (a) providing a base material comprising a plurality of fibers; said base material having a surface for polishing a substrate; (b) impregnating the surface of the base material with an elastomer solution; (c) curing the elastomer impregnated in the surface of the base material to form a plurality of first continuous pores embedded in the elastomer and fibers; (d) impregnating the surface of the base material and elastomer obtained in the step (c) with a condition polymer solution; and (e) curing the condition polymer impregnated in the surface of the base material and elastomer and partially filling the condition polymer into the first continuous pores to form a plurality of second continuous pores.

1 . A method of producing a polishing pad, comprising steps of: 
 (a) providing a base material comprising a plurality of fibers; said base material having a surface for polishing a substrate;    (b) impregnating the surface of the base material with an elastomer solution;    (c) curing the elastomer impregnated in the surface of the base material to form a plurality of first continuous pores embedded in the elastomer and fibers;    (d) impregnating the surface of the base material and elastomer obtained in the step (c) with a condition polymer solution; and    (e) curing the condition polymer impregnated in the surface of the base material and elastomer and partially filling the condition polymer into the first continuous pores to form a plurality of second continuous pores.    
     
     
         2 . The method according to  claim 1 , wherein the base material is a non-woven fabric.  
     
     
         3 . The method according to  claim 2 , wherein the base material is a rolled non-woven fabric.  
     
     
         4 . The method according to  claim 1 , wherein the fibers are selected from the group consisting of a single fiber and composite fibers.  
     
     
         5 . The method according to  claim 2 , wherein the fibers are composite fibers.  
     
     
         6 . The method according to  claim 2 , wherein the fibers are made of at least one material selected from the group consisting of polyamide, terephthalamide, polyester, polymethyl methacrylate, polyethylene terephthalate, and polyacrylonitrile.  
     
     
         7 . The method according to  claim 1 , wherein a length of the fibers is from 0.5 cm to 10.5 cm.  
     
     
         8 . The method according to  claim 1 , wherein the elastomers are foam resins.  
     
     
         9 . The method according to  claim 1 , wherein the elastomers are at least one selected from the group consisting of polyamide, polycarbonate, polyaminonitrile, polymethacrylate, epoxyl resin, phenolic resins, polymethyl methacrylate, polyaminoester, vinylbenzene polymer, acrylic resin, and polyurethane.  
     
     
         10 . The method according to  claim 1 , wherein step (b) further comprises impregnating the entire base material with the elastomer solution.  
     
     
         11 . The method according to  claim 1 , further comprising a step (c1) of washing the surface of the base material after the step (c).  
     
     
         12 . The method according to  claim 11 , further comprising a step (c2) of drying the surface of the base material after the step (c1).  
     
     
         13 . The method according to  claim 1 , further comprising a step (c3) of mechanically polishing the surface of the base material and the elastomers before the step (d).  
     
     
         14 . The method according to  claim 1 , wherein the condition polymers are detergent polymers, hardness mediating polymers, saturation degree mediating polymers, modulus mediating polymers, or hydrophilicity mediating polymers.  
     
     
         15 . The method according to  claim 1 , wherein the condition polymers are at least one selected from the group consisting of polyamide, polycarbonate, polyaminonitrile, polymethacrylate, epoxyl resin, phenolic resins, polymethyl methacrylate, polyaminoester, vinylbenzene polymer, acrylic resin, polyurethane, hydroxyl-containing polymer, silicon-containing hydrophobe, and fluoride-containing hydrophobe.  
     
     
         16 . The method according to  claim 1 , wherein step (d) further impregnating the entire base material with the condition polymer solution.  
     
     
         17 . The method according to  claim 1 , further comprising a step (e1) of washing the surface of the base material after the step (e).  
     
     
         18 . The method according to  claim 17 , further comprising a step (e2) of drying the surface of the base material after the step (e1).  
     
     
         19 . The method according to  claim 1 , further comprising a step (e3) of mechanically polishing the surface of the base material, the elastomers and the condition polymers.  
     
     
         20 . The method according to  claim 1 , wherein steps (b) and (c) are repeated for several times.  
     
     
         21 . The method according to  claim 1 , wherein steps (d) and (e) are repeated for several times.  
     
     
         22 . The method according to  claim 1 , wherein the elastomers are different from the condition polymers.  
     
     
         23 . The method according to  claim 1 , wherein the second continuous pores have a pore size ranging from 0.1 μm to 500 μm.  
     
     
         24 . A polishing pad comprising a base material having a surface for polishing a substrate, wherein the surface comprises a plurality of fibers, at lease one elastomer and at least one condition polymer, and a plurality of continuous pores are embedded in the fibers, elastomers and condition polymers.  
     
     
         25 . The polishing pad according to  claim 24 , wherein the base material is a non-woven fabric.  
     
     
         26 . The polishing pad according to  claim 25 , wherein the base material is a rolled non-woven fabric.  
     
     
         27 . The polishing pad according to  claim 24 , wherein the fibers are selected from the group consisting of a single fiber and composite fibers.  
     
     
         28 . The polishing pad according to  claim 27 , wherein the fibers are composite fibers.  
     
     
         29 . The polishing pad according to  claim 25 , wherein the fibers are made of at least one material selected from the group consisting of polyamide, terephthalamide, polyester, polymethyl methacrylate, polyethylene terephthalate, polyacrylonitrile, and mixture thereof.  
     
     
         30 . The polishing pad according to  claim 24 , wherein a length of the fibers is from 0.5 cm to 10.5 cm.  
     
     
         31 . The polishing pad according to  claim 24 , wherein the elastomers are foam resins.  
     
     
         32 . The polishing pad according to  claim 24 , wherein the elastomers are at least one selected from the group consisting of polyamide, polycarbonate, polyaminonitrile, polymethacrylate, epoxyl resin, phenolic resins, polymethyl methacrylate, polyaminoester, vinylbenzene polymer, acrylic resin, and polyurethane.  
     
     
         33 . The polishing pad according to  claim 24 , wherein the condition polymers are detergent polymers, hardness mediating polymers or hydrophilicity mediating polymers.  
     
     
         34 . The polishing pad according to  claim 33 , wherein the condition polymers are at least one selected from the group consisting of polyamide, polycarbonate, polyaminonitrile, polymethacrylate, epoxyl resin, phenolic resins, polymethyl methacrylate, polyaminoester, vinylbenzene polymer, acrylic resin, polyurethane, hydroxyl-containing polymer, silicon-containing hydrophobe, and fluoride-containing hydrophobe.  
     
     
         35 . The polishing pad according to  claim 24 , wherein the elastomers are different from the condition polymers.  
     
     
         36 . The polishing pad according to  claim 24 , wherein the continuous pores have a pore size ranging from 0.1 μm to 500 μm.  
     
     
         37 . A method of polishing a substrate comprising using the polishing pad according to  claim 24  to polish a surface of the substrate.