US2007010038A1PendingUtilityA1
Pattern forming method and wiring pattern forming method, and electro-optic device and electronic equipment
Est. expiryAug 12, 2023(expired)· nominal 20-yr term from priority
Inventors:Naoyuki Toyoda
H10P 14/20B82Y 30/00B41M 2205/38B41M 5/24B41M 5/46H10K 71/13
50
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Claims
Abstract
To provide a pattern forming method enabling a thin film to be patterned with high precision by easy and low cost techniques. A thin film 2 is provided on a base material 1 containing a sublimable dyestuff, light is irradiated to the base material 1 , and heat generated by the light irradiation sublimates the sublimable dyestuff in a desired region, thereby removing the thin film 2 corresponding to an irradiation region where the light is irradiated to thereby pattern this thin film 2.
Claims
exact text as granted — not AI-modified1 . An electro-optic device having a wiring pattern formed by a method of pattern forming comprising:
providing a thin film on a base material containing a sublimable material; irradiating light to the base material; and sublimating the sublimable material in a desired region by heat generated by the light irradiation, so as to remove the thin film corresponding to an irradiation region where the light is irradiated to thereby pattern the thin film to form the wiring pattern on the base material.
2 . Electronic equipment comprising the electro-optic device according to claim 1.Join the waitlist — get patent alerts
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