US2007004229A1PendingUtilityA1
Lamination of organic semiconductors
Est. expiryJul 22, 2023(expired)· nominal 20-yr term from priority
Inventors:Irina Malajovich
Y10T156/1705H10K 85/615H10K 71/16H10K 85/113H10K 71/18H10K 71/50H10K 85/649H10K 10/466H10K 10/00
44
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Claims
Abstract
Low temperature, ambient pressure processes are desired for fabrication of transistors on flexible polymer substrates. Lamination of semiconductors is such a process. The semiconductor is deposited on a donor substrate. The donor is positioned over a receiver substrate, which may be patterned with additional transistor elements. The semiconductor is transferred from the donor to the receiver by lamination.
Claims
exact text as granted — not AI-modified1 . (canceled)
2 . (canceled)
3 . An electronic device comprising an organic semiconductor laminated on a receiver substrate.
4 . The electronic device of claim 3 where the device is a transistor.
5 . The electronic device of claim 3 where the receiver substrate is a flexible polymer.
6 . The electronic device of claim 4 where the receiver substrate is a flexible polymer.
7 . An electronic device comprising at least one drop of a dried solution of an organic semiconductor wherein the drop was laminated on a receiver substrate.
8 . The electronic device of claim 7 wherein the receiver substrate is a flexible polymer.
9 . The electronic device of claim 7 wherein the organic semiconductor is selected from pentacene, alpha, alpha′-bis-4(n-hexyl)phenyl bitiophene and polythiophene.Join the waitlist — get patent alerts
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