Semiconductor device and portable apparatus and electronic apparatus comprising the same

Abstract

A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower surface of the sealing resin. The method includes a punching step for forming the lead by punching processing in a direction from the lower surface to its upper surface and a coining step for subjecting the lead to coining processing from the side of the upper surface after the punching processing.

1 - 5 . (canceled)  
   
   
       6 . A semiconductor device having a semiconductor chip resin-sealed thereinto, comprising: 
 the semiconductor chip;    a lead frame having a lead electrically connected to the semiconductor chip within sealing resin and a support for mounting the semiconductor chip, the lead being sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower surface of the sealing resin, the lower surface of the lead being a substantially flat surface, a difference of elevation due to coining processing from a side of an upper surface of the lead occurring between the upper surface of the lead and an upper surface of the support; and    the sealing resin for sealing the lead frame and the semiconductor chip such that the lower surface of the lead is exposed.    
   
   
       7 . The semiconductor device according to  claim 6 , wherein 
 plate thickness of the lead is smaller than plate thickness of the support due to the coining processing from the side of the upper surface.    
   
   
       8 . The semiconductor device according to  claim 6 , wherein 
 a plating layer for electrical connection to the semiconductor chip is formed on the upper surface of the lead.    
   
   
       9 . The semiconductor device according to  claim 8 , wherein 
 the plating layer, together with the lead, has been subjected to the coining processing from the side of the upper surface of the lead.    
   
   
       10 . A portable apparatus comprising a semiconductor device having a semiconductor chip resin-sealed thereinto, wherein 
 the semiconductor device comprises    the semiconductor chip;    a lead frame having a lead electrically connected to the semiconductor chip within sealing resin and a support for mounting the semiconductor chip, the lead being sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower surface of the sealing resin, the lower surface of the lead being a substantially flat surface, a difference of elevation due to coining processing from a side of an upper surface of the lead occurring between the upper surface of the lead and an upper surface of the support; and    the sealing resin for sealing the lead frame and the semiconductor chip such that the lower surface of the lead is exposed.    
   
   
       11 . An electronic apparatus comprising: 
 a wiring substrate;    a semiconductor device surface-mounted on the wiring substrate by joining a lead thereto; and    a case accommodating the wiring substrate on which the semiconductor device is mounted,    the semiconductor device comprising    the semiconductor chip,    a lead frame having a lead electrically connected to the semiconductor chip within sealing resin and a support for mounting the semiconductor chip, the lead being sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower surface of the sealing resin, the lower surface of the lead being a substantially flat surface, a difference of elevation due to coining processing from a side of an upper surface of the lead occurring between the upper surface of the lead and an upper surface of the support; and 
 the sealing resin for sealing the lead frame and the semiconductor chip such that the lower surface of the lead is exposed.