US2007001184A1PendingUtilityA1
Light-emitting device with built-in microlens and method of forming the same
Est. expiryAug 9, 2022(expired)· nominal 20-yr term from priority
H10H 20/855H10H 20/84G02B 6/4206G02B 6/4203H01S 5/0267H01S 5/4025H01S 5/4087
49
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Claims
Abstract
A light-emitting device with a built-in microlens having a microlens integrated with a semiconductor light-emitting device causing no misalignment of an optical axis is provided. This light-emitting device with a built-in microlens comprises a semiconductor light-emitting device and a microlens, integrated with the semiconductor light-emitting device, formed through light emitted from the semiconductor light-emitting device. Thus, the optical axis of the microlens is automatically aligned in formation of the microlens.
Claims
exact text as granted — not AI-modified1 - 14 . (canceled)
15 . A method of forming a light-emitting device with a built-in microlens, comprising steps of:
forming a photosensitive material on an emission surface of a semiconductor light-emitting device; and forming a microlens integrated with said semiconductor light-emitting device by irradiating said photosensitive material with light emitted from said semiconductor light-emitting device thereby reacting said photosensitive material.
16 . The method of forming a light-emitting device with a built-in microlens according to claim 15 , wherein
said step of forming said microlens includes a step of forming such a graded index microlens that the refractive index of a photo-irradiated portion of said photosensitive material is larger than the refractive index of the remaining unirradiated portion of said photosensitive material.
17 . The method of forming a light-emitting device with a built-in microlens according to claim 15 , wherein
said step of forming said microlens includes a step of forming a convex microlens by irradiating said photosensitive material with said light emitted from said semiconductor light-emitting device and thereafter etching a prescribed region of said photosensitive material.
18 . The method of forming a light-emitting device with a built-in microlens according to claim 15 , wherein
said step of forming said microlens includes a step of forming a concave microlens by irradiating said photosensitive material with said light emitted from said semiconductor light-emitting device thereby evaporating said photosensitive material.
19 . The method of forming a light-emitting device with a built-in microlens according to claim 15 , further comprising a step of performing heat treatment at a temperature around the glass transition temperature of said photosensitive material before irradiating said photosensitive material with said light emitted from said semiconductor light-emitting device, wherein
said step of forming said microlens includes a step of forming a graded index microlens having a convex shape by irradiating said photosensitive material with said light emitted from said semiconductor light-emitting device after said step of performing heat treatment.
20 . The method of forming a light-emitting device with a built-in microlens according to claim 15 , further comprising a step of forming a transparent insulating spacer on said emission surface of said semiconductor light-emitting device before forming said photosensitive material on said emission surface of said semiconductor light-emitting device.
21 . The method of forming a light-emitting device with a built-in microlens according to claim 15 , further comprising steps of:
forming a first antireflection coating on said emission surface of said semiconductor light-emitting device before forming said photosensitive material on said emission surface of said semiconductor light-emitting device, and forming a second antireflection coating on the surface of said photosensitive material after forming said photosensitive material on said emission surface of said semiconductor light-emitting device.
22 . The method of forming a light-emitting device with a built-in microlens according to claim 15 , wherein
said microlens consists of a photosensitive material of either chalcogenide glass or photoreactive organic matter.
23 . A method of forming a light-emitting device with a built-in microlens, comprising steps of:
arranging a photosensitive material in the vicinity of an emission surface of a semiconductor light-emitting device; and forming a convex microlens integrated with said semiconductor light-emitting device by irradiating said photosensitive material with light emitted from said semiconductor light-emitting device thereby evaporating said photosensitive material.
24 . The method of forming a light-emitting device with a built-in microlens according to claim 23 , wherein
said microlens consists of a photosensitive material of either chalcogenide glass or photoreactive organic matter.
25 . The method of forming a light-emitting device with a built-in microlens according to claim 15 , wherein
said step of forming said microlens includes a step of forming said microlens for each of a plurality of emission parts of said semiconductor light-emitting device having said plurality of emission parts.Join the waitlist — get patent alerts
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