Etching apparatus

Abstract

An etching apparatus, for etching copper or silver, which includes a hydrogen peroxide tank, an ammonium hydroxide tank, a water tank, an etching tank, a piping system and a temperature control device, is provided. The piping system connects the hydrogen peroxide tank, the ammonium hydroxide tank, the water tank to the etching tank, and the temperature control device is disposed around the hydrogen peroxide tank, the ammonium hydroxide tank and the etching tank to maintain the temperatures of them below the room temperature and above 12 degree centigrade. An etching process is also provided. First, hydrogen peroxide and ammonium hydroxide having a temperature in a temperature-range below the room temperature and above 12 degree centigrade, is provided. Then, water, hydrogen peroxide and ammonium hydroxide are mixed to be an etchant with a temperature maintained in said temperature temperature-range. Next, the etchant is utilized for etching copper or silver.

1 . An etching apparatus for etching copper or silver, comprising: 
 a hydrogen peroxide tank;    an ammonium hydroxide tank;    a water tank;    an etching tank;    a piping system, configured to make the hydrogen peroxide tank, the ammonium hydroxide tank and the water tank to be connected with the etching tank; and    a temperature control device, disposed around the hydrogen peroxide tank, the ammonium hydroxide tank and the etching tank to maintain the temperatures of them below the room temperature and above 12 degree centigrade.    
   
   
       2 . The etching apparatus according to  claim 1 , wherein the temperatures of the hydrogen peroxide tank, the ammonium hydroxide tank and the etching tank are maintained among 12 degree centigrade to 18 degree centigrade.  
   
   
       3 . The etching apparatus according to  claim 1 , wherein the temperature control device is also disposed around the water tank to maintain the temperature of the water tank below the room temperature and above 12 degree centigrade.  
   
   
       4 . The etching apparatus according to  claim 1 , wherein the temperature control device is also disposed around the piping system to maintain the temperature of the piping system below the room temperature and above 12 degree centigrade.  
   
   
       5 . The etching apparatus according to  claim 1 , further comprising a buffer tank disposed between the hydrogen peroxide tank, the ammonium hydroxide tank, the water tank and the etching tank, and the hydrogen peroxide tank, the ammonium hydroxide tank and the water tank are connected to the buffer tank through the piping system, and the buffer tank is also connected to the etching tank through the piping system.  
   
   
       6 . The etching apparatus according to  claim 5 , wherein the temperature control device is also disposed around the buffer tank to maintain the temperature of the buffer tank below the room temperature and above 12 degree centigrade.  
   
   
       7 . The etching apparatus according to  claim 1 , further comprising a pump connected to the piping system.  
   
   
       8 . The etching apparatus according to  claim 1 , further comprising a flow meter disposed in the piping system between the hydrogen peroxide tank, the ammonium hydroxide tank, the water tank and the etching tank.