Electronic component and method for manufacturing the same

Abstract

Electrode layers ( 1, 2 ) are arranged on both sides of a dielectric layer ( 3 ) facing each other so as to configure a capacitor. Lead electrodes ( 4, 5 ) are formed in the electrode layers ( 1, 2 ). A penetrating electrode ( 6 ) that is insulated from the electrode layers ( 1, 2 ) is formed. An electronic component ( 10 ) configured in this manner is mounted on a wiring board, and a semiconductor chip can be mounted thereon. Along with connecting the semiconductor chip to the wiring board via the penetrating electrode ( 6 ), the semiconductor chip or the wiring board is connected to the lead electrodes ( 4, 5 ). In this manner, while suppressing the size increase of a mounted area, the capacitor or the like can be arranged near the semiconductor chip. Thus, the semiconductor chip is driven with high frequency more easily.

1 - 15 . (canceled)  
   
   
       16 . A method for manufacturing an electronic component comprising a plurality of dielectric thin films, the method comprising: 
 depositing a dielectric thin film having an opening in a predetermined portion a plurality of times, so that a layered product that comprises said dielectric thin film with a penetrating hole that penetrates in a deposition direction is obtained.    
   
   
       17 . The method for manufacturing the electronic component according to  claim 16 , wherein said dielectric thin film having the opening is obtained by depositing said dielectric thin film and then irradiating a laser beam to a predetermined portion to remove a part of said dielectric thin film.  
   
   
       18 . The method for manufacturing the electronic component according to  claim 17 , wherein the laser beam is a carbon dioxide gas laser.  
   
   
       19 . The method for manufacturing the electronic component according to  claim 16 , wherein said dielectric thin film having the opening is obtained by oil masking.  
   
   
       20 . The method for manufacturing the electronic component according to  claim 19 , wherein an oil used for the oil masking is a hydrocarbon-based oil, a mineral oil or a fluorocarbon oil.  
   
   
       21 . The method for manufacturing the electronic component according to  claim 16 , wherein, after a plurality of times of depositing said dielectric thin films, a conductive substance is filled in the penetrating hole of the layered product that is obtained.  
   
   
       22 - 40 . (canceled)