Soft copper alloy, and soft copper wire or plate material

Abstract

A soft copper alloy contains 10 mass ppm or less of oxygen, and more than 0.005 mass % and less than 0.6 mass % of indium. A soft copper alloy wire or plate material is manufactured by processing the soft copper alloy, wherein an average crystal grain size after annealing is 2 to 20 um.

1 . A soft copper alloy, comprising: 
 mass ppm or less of oxygen; and    more than 0.005 mass % and less than 0.6 mass % of indium.    
   
   
       2 . The soft copper alloy according to  claim 1 , further comprising: 
 0.0001 to 0.003 mass % of phosphorus.    
   
   
       3 . The soft copper alloy according to  claim 1 , further comprising: 
 0.001 to 0.1 mass % of boron.    
   
   
       4 . The soft copper alloy according to  claim 1 , further comprising: 
 phosphorus and boron together in a range of 0.1 mass % or less.    
   
   
       5 . The soft copper alloy according to  claim 1 , wherein: 
 a temperature of molten alloy in casting is 10 to 50 degrees higher than a melting point of the alloy so that a crystal structure in cast bar comprises an equiaxed crystal.    
   
   
       6 . A soft copper alloy wire or plate material manufactured by processing the soft copper alloy according to claim if wherein an average crystal grain size after annealing is 2 to 20 um.  
   
   
       7 . The soft copper alloy wire or plate material according to  claim 6 , wherein 0.2% proof strength is 130 MPa or more.  
   
   
       8 . The soft copper alloy wire or plate material according to  claim 6 , wherein tin or Mg or Ag is included in a range of a conductivity not lower than 85% IACS.  
   
   
       9 . The soft copper alloy wire or plate material according to  claim 7 , wherein tin or Mg or Ag is included in a range of a conductivity not lower than 85% IACS.  
   
   
       10 . The soft copper alloy wire or plate material according to  claim 6 , wherein a tensile strength after heating for 1 hour at 400° C. is within 4%.  
   
   
       11 . The soft copper alloy wire or plate material according to  claim 7 , wherein a tensile strength after heating for 1 hour at 400° C. is within 4%.  
   
   
       12 . The soft copper alloy wire or plate material according to  claim 8 , wherein a tensile strength after heating for 1 hour at 400° C. is within 4%.