Contact Structures Comprising A Core Structure And An Overcoat

Abstract

A contact structure can comprise a core structure on a substrate and over coat material on the core structure. The over coat material can be harder or have a greater yield strength than the material of the core structure. The core structure can be formed by attaching a wire to the substrate and spooling the wire out from a spool. While spooling the wire out, the spool can be moved to impart a desired shape to the wire. The wire can be severed from the spool and over coated. As an alternative, the wire need not be over coated. The substrate can be an electronic device, such as a semiconductor die.

1 - 38 . (canceled)  
     
     
         39 . A contact structure comprising: 
 a core structure attached to a substrate; and    an overcoat covering at least a portion of said core structure,    wherein said over coat comprises a material that is one of harder or has a greater yield strength than a material of said core structure.    
     
     
         40 . The contact structure of  claim 39 , wherein said core structure comprises a wire.  
     
     
         41 . The contact structure of  claim 39 , wherein said wire has a shape that includes at least one reversal of direction.  
     
     
         42 . The contact structure of  claim 39 , wherein said substrate comprises a terminal and said wire is attached to said terminal.  
     
     
         43 . The contact structure of  claim 39 , wherein said material of said over coat is harder than said material of said core structure.  
     
     
         44 . The contact structure of  claim 39 , wherein said material of said over coat has a greater yield strength than said material of said core structure.  
     
     
         45 . The contact structure of  claim 39 , wherein said substrate is a semiconductor device.  
     
     
         46 . The contact structure of  claim 45 , wherein said semiconductor device is a singulated die.  
     
     
         47 . The contact structure of  claim 46 , wherein said die is unpackaged.  
     
     
         48 . The contact structure of  claim 45 , wherein said semiconductor device is a die of an unsingulated semiconductor wafer.