US2006286801A1PendingUtilityA1

Process chamber assembly and apparatus for processing a substrate

Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Jun 16, 2005Filed: Jun 8, 2006Published: Dec 21, 2006
Est. expiryJun 16, 2025(expired)· nominal 20-yr term from priority
Inventors:Ho-Gon Kim
H10P 72/0441H10P 95/00C23C 16/44C23C 16/4409
35
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Claims

Abstract

In a process chamber assembly and a processing apparatus for processing a substrate using, a process chamber assembly may include a process chamber including a body having a first contact face and a cover for covering the body having a second contact face, the second contact face of the cover seals the body at the first contact face thereof forming a buffer space therebetween, and at least one combining unit in fluid communication with the buffer space and configured to provide vacuum therein.

Claims

exact text as granted — not AI-modified
1 . A process chamber assembly comprising: 
 a process chamber including a body having a first contact face; and 
 a cover having a second contact face, the second contact face of the cover sealing the body at the first contact face and forming a first buffer space therebetween; and  
   at least one combining unit in fluid communication with the first buffer space and configured to provide vacuum therein.    
   
   
       2 . The assembly of  claim 1 , wherein the first contact face of the body includes a first groove to provide the first buffer space.  
   
   
       3 . The assembly of  claim 1 , wherein the second contact face of the cover includes a second groove to provide the first buffer space.  
   
   
       4 . The assembly of  claim 1 , wherein the first contact face of the body includes a first groove and the second contact face of the cover includes a second groove to provide the first buffer space.  
   
   
       5 . The assembly of  claim 2 , wherein the second contact face of the cover includes a protrusion, the protrusion protruding into the first groove when the second contact face of the cover seals the body at the first contact face thereof, and a height of the protrusion being smaller than a depth of the first groove.  
   
   
       6 . The assembly of  claim 3 , wherein the first contact face of the body includes protrusion, the protrusion protruding into the first groove when the second contact face of the cover seals the body at the first contact face thereof, and a height of the protrusion being smaller than a depth of the first groove.  
   
   
       7 . The assembly of  claim 2 , wherein the first contact face of the body further includes a third groove to provide for a second buffer space.  
   
   
       8 . The assembly of  claim 7 , wherein the first and third grooves are continuous concentric circles, and are formed in two different concentric planes.  
   
   
       9 . The assembly of  claim 7 , wherein the first and third grooves are semi-circular, disconnected, and provided in a same concentric plane.  
   
   
       10 . The assembly of  claim 9 , wherein each of the first and second grooves is in fluid communication with the at least one combining unit.  
   
   
       11 . The assembly of  claim 7 , wherein the first contact face of the body further includes a fourth groove and a fifth groove to provide a third buffer space and a fourth buffer space, respectively.  
   
   
       12 . The assembly of  claim 1 , wherein each of the first, second, fourth, and fifth grooves is in fluid communication with the at least one combining unit.  
   
   
       13 . The assembly of  claim 1 , further including a sealing member interposed between the first contact face of the body and the second contact face of the cover, the sealing member providing hermetic sealing between the body and cover.  
   
   
       14 . The assembly of  claim 1 , wherein the at least one combining unit includes: 
 a pump unit configured to provide vacuum into the first buffer space;    a first line configured to connect the pump unit to the first buffer space; and    a valve configured to open and close the first line.    
   
   
       15 . The assembly of  claim 8 , wherein the at least one combining unit includes: 
 a pump unit configured to provide vacuum into the first buffer space;    a first line configured to connect the pump unit to the first buffer space;    a second line connected to the first line on one end and connected to the second buffer space on the other end; and    a valve configured to open and close the first line.    
   
   
       16 . The assembly of  claim 14 , further including a separating unit configured to separate the cover from the body by providing a gas between the first and second contact faces.  
   
   
       17 . The assembly of  claim 14 , wherein the at least one combining unit further includes a second line, the second line connected to the first line on one end and connected to the second buffer space opposite to a connection point of the first line and the second buffer space on the other end.  
   
   
       18 . A processing apparatus for processing a substrate, comprising: 
 the process chamber assembly of  claim 1;  and    a gas-supplying unit configured to provide processing gas.    
   
   
       19 . The apparatus of  claim 19 , further including a cleaning unit connected to the process chamber and configured to clean the process chamber.  
   
   
       20 . The apparatus of  claim 19 , further including a separating unit configured to separate the cover from the body by providing a gas between the first and second contact faces.

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