Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same

Abstract

An electrical connection is formed by using a double laminated conductive fine particle provided with a conductive metal layer on the surface of a spherical elastic base particle by electroless plating and electroplating and a layer of a low-melting-point-metal on the surface of the conductive metal layer and wherein the conductive metal layer comprise a plurality of metal layers.

1 . A laminated conductive fine particle provided with a conductive metal layer on the surface of a spherical elastic base particle and further provided with a low-melting-point metal layer on the surface of the conductive metal layer, 
 wherein the conductive metal layer is formed by at least one element selected from the group consisting of nickel, palladium, gold, silver, copper, platinum and aluminum,    wherein the low-melting-point metal layer is formed by at least one element having a melting point of not more than 260° C. selected from the group consisting of tin, lead, bismuth, silver, zinc, indium, and copper.    
   
   
       2 . The laminated conductive fine particle according to  claim 1 , 
 wherein the thickness (t; unit mm) of the conductive metal layer is set in a range represented by formula [1]       P×D/σ<t< 0.2 ×D   [formula 1]   where P is a constant of pressure unit, 0.7 Kg/mm 2 , D is the diameter (unit:mm) of an elastic base particle, and σ is a tensile strength (unit:Kg/mm 2 ) of metal material forming the conductive metal layer which is measured under the condition that a sheet shaped from the metal material having a thickness of 0.5 to 2 mm is tested at a tensile speed of 10 mm/mm by tensile tester.    
   
   
       3 . The laminated conductive fine particle according to  claim 1 , wherein the low-melting-point metal layer has a thickness of not more than 50% of the diameter of the elastic base particles.  
   
   
       4 . The laminated conductive fine particle according to  claim 1 , 
 wherein the low-melting-point metal layer has a thickness of not less than 3% of the diameter of the elastic base particles.    
   
   
       5 . The laminated conductive fine particle according to  claim 1 , 
 wherein the spherical elastic base particle have a thermal conductivity of not less than 0.30 W/m K.    
   
   
       6 . The laminated conductive fine particle according to  claim 1 , 
 wherein the spherical elastic base particle is a resin material or an organic/inorganic hybrid material.    
   
   
       7 . The laminated conductive fine particle according to  claim 1 , 
 wherein the spherical elastic base particle further includes an inorganic filler.