Flip-chip light-emitting device with micro-reflector

Abstract

A Flip-chip light-emitting device with integral micro-reflector. The flip-chip light-emitting device emits reflected light provided by a light-emitting layer. The micro-reflector reflects light that might otherwise be lost to internal refraction and absorption, so as to increase light-emitting efficiency.

1 . A flip-chip light-emitting device with a micro-reflector comprising: 
 a substrate;    a first semiconductor stack layer formed over the substrate;    a light-emitting layer formed over the first semiconductor stack layer;    a second semiconductor stack layer formed over the light-emitting layer; and    a micro-reflector formed over the second semiconductor stack layer comprising a transparent patterned layer and a reflective layer formed over the transparent patterned layer.    
   
   
       2 . The flip-chip light-emitting device with a micro-reflector of  claim 1  further comprising a transparent adhesive layer between the first semiconductor stack layer and the substrate.  
   
   
       3 . The flip-chip light-emitting device with a micro-reflector of  claim 2  further comprising a first reaction layer between the transparent adhesive layer and the substrate.  
   
   
       4 . The flip-chip light-emitting device with a micro-reflector of  claim 2  further comprising a second reaction layer between the transparent adhesive layer and the first semiconductor stack layer.  
   
   
       5 . The flip-chip light-emitting device with a micro-reflector of  claim 4  further comprising a transparent conductive layer between the second reaction layer and the first semiconductor stack layer.  
   
   
       6 . The flip-chip light-emitting device with a micro-reflector of  claim 2  further comprising a transparent conductive layer between the transparent adhesive layer and the first semiconductor stack layer.  
   
   
       7 . The flip-chip light-emitting device with a micro-reflector of  claim 1  wherein the shape of the transparent patterned layer corresponds to a graph profile selected from a graph profile group consisting of semicircular, pyramidical, and conical.  
   
   
       8 . The flip-chip light-emitting device with a micro-reflector of  claim 1  wherein the shape of the reflective layer corresponds to a graph profile selected from a graph profile group consisting of semicircular, pyramidical, and conical.  
   
   
       9 . The flip-chip light-emitting device with a micro-reflector of  claim 1  wherein the shape of the transparent patterned layer corresponds to a discontinuous distributed geometric graph profile.  
   
   
       10 . The flip-chip light-emitting device with a micro-reflector of  claim 1  wherein the reflective layer comprises a material selected from a material group consisting of Sn, Al, Au, Pt, Zn, Ag, Ti, Pb, Pd, Ge, Cu, AuBe, AuGe, Ni, PbSn, AuZn, and indium tin oxide.  
   
   
       11 . The flip-chip light-emitting device with a micro-reflector of  claim 1  wherein the substrate is connected to the micro-reflector by direct wafer bonding.