Method of installing IC tag in packaged commodity

Abstract

An IC tag is installed in a blister pack in which a commodity is stored in a cavity formed in a transparent resin sheet and the periphery of the transparent resin sheet is joined to a backing sheet. The antenna of the IC tag or the connection line in connection with its IC chip is provided at the joint location between the transparent resin sheet and the backing sheet. Once the connection between the transparent resin sheet and the backing sheet is broken and the commodity is taken out, the antenna or the connection line is broken, which disables the IC tag. Therefore, an unlawful item that cannot be identified from its appearance is detected by accessing the IC tag using a reader/writer.

1 . A method of installing an IC tag in a packaged commodity, comprising installing an IC tag including an IC chip and an antenna connected to the IC chip through a connection line in a blister pack in which a commodity provided on a backing sheet is stored in a cavity formed in a transparent resin sheet and a periphery of the transparent resin sheet is joined to the backing sheet, and wherein 
 the antenna or the connection line of the IC tag is provided at a joint surface between the transparent resin sheet and the backing sheet.    
     
     
         2 . A method of installing an IC tag in a packaged commodity, comprising installing an IC tag including an IC chip and an antenna connected to the IC chip through a connection line in a blister pack in which a commodity provided on a backing sheet is stored in a cavity formed in a transparent resin sheet, a periphery of the transparent resin sheet is joined to the backing sheet, and a perforation for taking out the commodity is formed at the backing sheet in a location corresponding to the cavity, and wherein 
 the antenna or the connection line of the IC tag is provided across the perforation formed at the backing sheet.    
     
     
         3 . A method of installing an IC tag in a packaged commodity, comprising installing an IC tag including an IC chip and an antenna connected to the IC chip through a connection line in a blister pack in which a commodity provided on a backing sheet is stored in a cavity formed in a transparent resin sheet and a periphery of the transparent resin sheet is joined to the backing sheet, and a perforation for taking out the commodity is formed at the backing sheet in a location corresponding to the cavity, and wherein 
 part of the antenna is provided at a joint surface between the transparent resin sheet and the backing sheet, and the antenna or the connection line is provided across the perforation formed at the backing sheet.    
     
     
         4 . The method of installing an IC tag in a packaged commodity according to  claim 1 , wherein 
 the backing sheet is made of the same sheet material as the transparent resin sheet, and the backing sheet and the transparent resin sheet are fitted with each other and adhered at their peripheries to constitute a clamshell structure.    
     
     
         5 . The method of installing an IC tag in a packaged commodity according to  claim 2 , wherein 
 the backing sheet is made of the same sheet material as the transparent resin sheet, and the backing sheet and the transparent resin sheet are fitted with each other and adhered at their peripheries to constitute a clamshell structure