Method of electroplating

Abstract

An electroplating base includes a separate electrically conductive section isolated from an electrically conductive section. An electrically conductive connecting pattern connects the separate electrically conductive section to the electrically conductive section. Electroplating allows establishment of electroplating films on the electrically conductive section and the separate electrically conductive section. A non-conductive path extends in the electroplating base from a point of a non-conductive section to a point of the non-conductive section. The ends of the non-conductive path are connected to the non-conductive section, so that generation of electroplating films is reliably avoided at the ends of the non-conductive path. The obtained non-conductive section and non-conductive path serve to reliably insulate the electroplating film on the electrically conductive section and the electroplating film on the separate electrically conductive section from each other.

1 . A method of electroplating, comprising forming an electrically conductive electroplating base over a wafer, wherein a non-conductive section, at least a non-conductive path and an electrically conductive connecting pattern are formed on a surface of the wafer: 
 said non-conductive section extending along a predetermined cutting line in a space between first and second regions;    said non-conductive path extending in the second region from a point of the non-conductive section to a point of the non-conductive section, said non-conductive path defining a separate electrically conductive section isolated in the second region; and    said electrically conductive connecting pattern crossing the non-conductive section, said electrically conductive connecting pattern connecting the separate electrically conductive section to an electrically conductive section within the first region.    
   
   
       2 . The method of electroplating according to  claim 1 , further comprising supplying electric current to the separate electrically conductive section from the electrically conductive connecting pattern so as to form an electroplating film over the separate electrically conductive section.  
   
   
       3 . The method of electroplating according to clam  2 , further comprising forming a resist film over the electrically conductive connecting pattern and the non-conductive section prior to establishment of the electroplating film.  
   
   
       4 . The method of electroplating according to  claim 2 , further comprising cutting the wafer along the predetermined cutting line after the electroplating film has been formed.