Methods Of Making A Interconnect

Abstract

An interconnect formed using a stiff layer having a plurality of holes extending there through. A first flexible layer is bonded to a first side of the stiff layer. The first flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. A second flexible layer is bonded to a second side of the stiff layer. The second flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. Signal paths are formed in the holes, the signal paths connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.

1 . An interconnect comprising: 
 a stiff layer having a plurality of holes extending there through;    a first flexible layer bonded to a first side of the stiff layer, the first flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole;    a second flexible layer bonded to a second side of the stiff layer, the second flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole; and    signal paths formed in the holes, the signal paths connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.    
   
   
       2 . An interconnect, as set forth in  claim 1 , wherein the stiff layer comprises a multilayer printed circuit board with an embedded ground plane.  
   
   
       3 . An interconnect, as set forth in  claim 1 , wherein the stiff layer comprises a multilayer printed circuit board with a plurality of embedded ground planes.  
   
   
       4 . An interconnect, as set forth in  claim 1 , wherein each signal path comprises an electrically conductive material bonded to an inner wall of the hole.  
   
   
       5 . An interconnect as set forth in  claim 4 , wherein each signal path further comprises blind micro vias extending through the first and second flexible layers connecting associated bumps with the electrically conductive material bonded to an inner wall of the hole.  
   
   
       6 . An interconnect, as set forth in  claim 1 , wherein the first and second flexible layers comprise flexible circuit boards.  
   
   
       7 . An interconnect, as set forth in  claim 1 , wherein the plurality of conductive bumps have one of a conical, columnar, or cubical shape.  
   
   
       8 . An interconnect, as set forth in  claim 1 , wherein the plurality of bumps on the first flexible surface have a pitch of 1.0 mm or less.  
   
   
       9 . An interconnect, as set forth in  claim 1 , wherein the plurality of bumps on the first flexible surface have a pitch of less than 2.0 mm.  
   
   
       10 . An interconnect, as set forth in  claim 1 , wherein the plurality of bumps on the first flexible surface have a pitch of less than 5.0 mm.  
   
   
       11 . An interconnect, as set forth in  claim 1 , wherein each signal path comprises: 
 conductive material bonded to an inner wall of the hole;    a first via extending through the first flexible layer over the edge of the hole, the via being electrically connected to the conductive material bonded Loan inner wall of the hole;    a second via extending though the second flexible layer over the edge of the hole, the via being electrically connected to the conductive material bonded to an inner wall of the hole;    tracings on the first flexible layer connecting a conductive bumps to the first via; and    tracings on the second flexible layer connecting a conductive bumps to the second via.    
   
   
       12 . An interconnect, as set forth in  claim 11 , wherein the signal paths further comprise: 
 a third via extending through the first flexible layer over the edge of the hole, the via being electrically connected to the conductive material    bonded to an inner wall of the hole;    a fourth via extending though the second flexible layer over the edge of the hole, the via being electrically connected to the conductive material bonded to an inner wall of the hole; and    wherein the tracings on the first flexible layer connecting the conductive bumps to the third via and the tracings on the second flexible layer connecting the conductive bumps to the fourth via.    
   
   
       13 . An interconnect comprising: 
 a stiff layer having a plurality of holes therein;    a ground plane embedded in the stiff layer;    a first flexible layer bonded to a first side of the stiff layer, the first flexible layer having a plurality of conductive bumps thereon positioned over holes;    a second flexible layer bonded to a second side of the stiff layer, the second flexible layer having a plurality of conductive bumps thereon positioned    over holes; and signal paths embedded in the stiff layer connecting the plurality of conductive bumps on the first layer to the plurality of conductive    bumps on the second layer.    
   
   
       14 . An interconnect comprising: 
 a stiff layer having a plurality of holes therein;    a conductive coating bonded to the walls of each of the plurality of holes;    a first flexible layer bonded to a first side of the stiff layer, the first flexible layer having a plurality of conductive bumps thereon positioned over the holes;    a second flexible layer bonded to a second side of the stiff layer, the second flexible layer having a plurality of conductive bumps thereon positioned p 1  over the holes forming a plurality of pairs of conductive bumps, each pair, including one conductive bump on the first flexible layer and    one conductive bump on the second conductive layer;    a plurality of vias, each via being associated with a conductive bump and extending through a respective first or second flexible layer through the    stiff layer, each via being positioned over the wall of the hole associated with the associated conductive bump;    tracings on the first flexible layer connecting each conductive bump to an associated via;    tracings on the second flexible layer connecting each conductive bumps to an associated via; and    wherein the portions of the first and second flexible layers adjacent to the conductive bumps are displaced into the plurality of holes when the interconnect is sandwiched between two connectors.    
   
   
       15 . An interconnect, as set forth in  claim 14 , wherein the plurality of vias are blind micro vias.  
   
   
       16 . An interconnect comprising: 
 a stiff layer having a plurality of holes therein;    a ground plane embedded in the stiff layer;    a first flexible layer bonded to a first side of the stiff layer, the first flexible layer having a plurality of conductive bumps thereon positioned over the holes;    a second flexible layer bonded to a second side of the stiff layer, the second flexible layer having a plurality of conductive bumps thereon positioned    over the holes forming a plurality of pairs of conductive bumps, each pair including one conductive bump on the first flexible layer and one    conductive bump on the second conductive layer;    a plurality of vias, each via extending from the first flexible layer through the stiff layer to the second flexible layer, each via being associated with a pair of conductive bumps;    tracings on the first flexible layer connecting each conductive bump to an associated via;    tracings on the second flexible layer connecting each conductive bump to an associated via; and    wherein the portions of the first and second flexible layers adjacent to the conductive bumps are displaced into the plurality of holes when the    interconnect is sandwiched between two connectors.    
   
   
       17 . A method of making an interconnect, comprising: 
 forming plurality of holes in a stiff layer with an embedded ground plane; bonding a first flexible layer to the first side of the stiff layer;    bonding a second flexible layer to the second side of the stiff layer; forming a plurality of vias from the first flexible layer to the second flexible    layer through the stiff layer;    forming conductive bumps on the first flexible layer, each conductive bump being formed over a hole in the stiff layer and in electrical    communication with a via; and    forming conductive bumps on the second flexible layer, each conductive bump being formed over a hole in the stiff layer and in electrical    communication with a via where by the conductive bumps formed on the first flexible layer are electrically connected to the conductive bumps    formed on the second flexible layer.    
   
   
       18 . A method of making an interconnect, comprising: 
 forming plurality of holes in a stiff layer with an embedded ground plane; coating the walls of the plurality of holes with a conductive material;    bonding a first flexible layer to the first side of the stiff layer;    bonding a second flexible layer to the second side of the stiff layer;    forming a plurality of vias from through the first flexible layer over the walls of the holes;    forming a plurality of vias from through the second flexible layer over the walls of the holes;    forming conductive bumps on the first flexible layer, each conductive bump being formed over a hole in the stiff layer and in electrical    communication with an associated via; and    forming conductive bumps on the second flexible layer, each conductive bump being formed over a hole in the stiff layer and in electrical    communication with an associated via where by the conductive bumps formed on the first flexible layer are    electrically connected to the conductive bumps formed on the second flexible layer by the conductive coating on the wall of the associated hole.