Hermetically sealed package and methods of making the same

Abstract

Hermetically sealed packages having organic electronic devices are presented. A number of sealing mechanisms are provided to hermetically seal the package to protect the organic electronic device from environmental elements. A metal alloy sealant layer is employed proximate to the organic electronic device. Alternatively, a metal alloy sealant layer in combination with primer layer may also be implemented. Further, superstrates and edge wraps may be provided to completely surround the organic electronic device.

1 . A hermetically sealed package comprising: 
 a first substrate configured to receive an organic electronic device;    an organic electronic device disposed on the first substrate;    a first primer layer disposed on the first substrate, wherein the first primer layer is disposed about the perimeter of the organic electronic device;    a metal alloy sealant layer disposed on the first primer layer and about the perimeter of the organic electronic device;    a second primer layer disposed on the metal sealant layer; and    a second substrate disposed on the second layer of primer and disposed above and proximate to the organic electronic device.    
   
   
       2 . The hermetically sealed package of  claim 1 , wherein the first substrate comprises a flexible substrate.  
   
   
       3 . The hermetically sealed package of  claim 1 , wherein the first substrate comprises a composite structure.  
   
   
       4 . The hermetically sealed package of  claim 1 , wherein the first substrate comprises a polymeric material.  
   
   
       5 . The hermetically sealed package of  claim 1 , wherein the first substrate comprises a plastic, a metal foil, or a glass.  
   
   
       6 . The hermetically sealed package of  claim 1 , comprising a barrier coating disposed between the first substrate and the organic electronic device.  
   
   
       7 . The hermetically sealed package of  claim 1 , wherein the organic electronic device comprises an organic electroluminescent device or an organic photovoltaic device.  
   
   
       8 . The hermetically sealed package of  claim 1 , wherein a melting point of the metal alloy sealant is configured to be greater than an operating temperature of the organic electronic device.  
   
   
       9 . The hermetically sealed package of  claim 1 , wherein the metal alloy sealant layer comprises alloys of bismuth, or tin, or lead, or indium, or cadmium, or combinations thereof.  
   
   
       10 . The hermetically sealed package of  claim 9 , wherein a volume percent of bismuth ranges from about 0 to about 50%, or a volume percent of tin ranges from about 5% to about 50%, or a volume percent of lead ranges from about 0 to about 50%, or a volume percent of indium ranges from about 0 to about 55%, or a volume percent of cadmium ranges from about 0 to about 15%.  
   
   
       11 . The hermetically sealed package of  claim 1 , wherein the second substrate comprises a superstrate.  
   
   
       12 . A hermetically sealed package comprising: 
 a first substrate configured to receive an organic electronic device;    an organic electronic device disposed on an upper surface of the substrate;    an insulating adhesive layer disposed above the organic electronic device;    a superstrate coupled to the insulating adhesive layer and disposed proximate to the organic electronic device, wherein the superstrate comprises a peripheral portion adapted to wrap around edges of the package such that the peripheral portion of the superstrate is coupled to a lower surface of the substrate opposite the organic electronic device; and    a metal alloy sealant layer disposed on the lower surface of the substrate such that the peripheral portion of the superstrate is hermetically sealed to the lower surface of the substrate.    
   
   
       13 . The hermetically sealed package of  claim 12 , further comprising a desiccant material disposed within pockets formed by wrapping the edges of the package with the superstrate.  
   
   
       14 . The hermetically sealed package of  claim 12 , further comprising a primer layer disposed between the metal alloy sealant layer and the lower surface of the substrate and between the metal alloy sealant layer and the peripheral portion of the superstrate.  
   
   
       15 . The hermetically sealed package of  claim 14 , wherein the primer layer comprises tin.  
   
   
       16 . A hermetically sealed package comprising: 
 a first substrate having an inner side and an outer side;    an organic electronic device disposed on the inner side of the first substrate;    an insulating layer disposed above the organic electronic device;    a second substrate having an inner side and an outer side, wherein the second substrate is coupled to the insulating adhesive such that the inner side of the second substrate is disposed proximate the organic electronic device;    an edge wrap coupled to the outer sides of each of the first and second substrates and configured to hermetically seal the peripheral edges of the package; and    a metal alloy sealant layer coupled to the outer sides of each of the first and second substrates and to the edge wrap such that the edge wrap is hermetically sealed to the outer sides of each of the first and second substrates.    
   
   
       17 . The hermetically sealed package of  claim 16 , wherein each of the first substrate and the second substrate comprises a composite structure.  
   
   
       18 . The hermetically sealed package of  claim 16 , wherein the edge wrap comprises a metal foil.  
   
   
       19 . The hermetically sealed package of  claim 16 , further comprising a primer layer disposed between the edge wrap and the outer sides of each of the first and second substrates.  
   
   
       20 . The hermetically sealed package of  claim 16 , further comprising a desiccant material disposed within pockets formed by wrapping the edges of the package with the edge wrap.  
   
   
       21 . A method of fabricating a hermetically sealed electronic package comprising: 
 disposing a plurality of organic electronic devices on a substrate;    providing a metal foil having approximately the same dimensions as the substrate;    patterning the metal foil with a plurality of patterns comprising a metal alloy sealant, wherein each of the plurality of patterns is sized to completely surround the organic electronic devices upon coupling the metal foil with the substrate; and    coupling the metal foil to the substrate.    
   
   
       22 . The method of  claim 21 , comprising heating the metal alloy sealant to form a melt of the metal alloy sealant.  
   
   
       23 . The method of  claim 21 , further comprising; 
 disposing a first primer layer between the substrate and each of the plurality of patterns; and    disposing a second primer layer around the perimeter of each of the plurality of organic electronic devices.    
   
   
       24 . The method of  claim 23 , wherein at least one of the first and second primer layer comprises tin.