Thin-plate supporting container

Abstract

When a thin-plate supporting container is placed on a placement table, a displacement is corrected and the thin-plate supporting container is precisely positioned. The thin-plate supporting container includes a container body 22 for housing therein a semiconductor wafer and the like and positioning means 23 provided to the container body 22 for positioning the container body at a set position on a placement table to place the container body on the placement table and take in and out the semiconductor wafer and the like. The positioning means 23 includes an engagement groove 24 for engaging an engagement protrusion provided on the placement table, and an inclined plane 25 to be in contact with the engagement protrusion in a state the engagement groove engages with the engagement protrusion. The inclined plane is treated so as to reduce a contact area with the engagement protrusion to decrease the friction resistance by embossing.

1 . A thin-plate supporting container comprising: 
 a container body for housing therein a thin-plate; and    positioning means provided to the container body for positioning the container body at a set position on a placement table to place the container body on the placement table and take in and out the internal thin-plate;    wherein the positioning means includes an engagement groove for engaging an engagement protrusion provided on the placement table, and a inclined plane to be in contact with the engagement protrusion in a state the engagement groove engages with the engagement protrusion, and the inclined plane is treated so that friction resistance is reduced.    
   
   
       2 . The thin-plate supporting container according to  claim 1 , wherein the inclined plane of the engagement groove in the positioning means is treated so as to reduce a contact area of the inclined plane and the engagement protrusion to decrease the friction resistance.  
   
   
       3 . The thin-plate supporting container according to  claim 1 , wherein the inclined plane of the engagement groove in the positioning means is treated so as to reduce the friction resistance by embossing.