Physical quantity sensor, lead frame, and manufacturing method therefor

Abstract

A physical quantity sensor is constituted using a lead frame having at least one stage and a plurality of leads whose bases are arranged in the same plane, wherein at least one physical quantity sensor chip having a plurality of electrode pads is mounted on the stage and is inclined so that the electrode pads are disposed in the inclination direction and are connected to the leads by use of wires whose lengths substantially match distances between the electrode pads and leads. This prevents the leads and wires from being unexpectedly broken, and it is possible to avoid the occurrence of separation of the leads from the physical quantity sensor chip. In addition, the tip ends of the leads are disposed along the surface of the inclined stage before wire bonding; hence, it is possible to easily connect the tip ends of the leads to the physical quantity sensor chip.

1 . A lead frame comprising: 
 at least one stage for mounting a physical sensor chip thereon;    a frame having a plurality of leads that are arranged around the stage; and    a plurality of interconnection portions for interconnecting the stage to the frame,    wherein base portions of the leads that are separated from the stage are disposed substantially in a prescribed plane, the stage is inclined with respect to the prescribed plane, and tip ends of the leads are disposed along a surface of the stage.    
   
   
       2 . A lead frame that is formed by processing a thin metal plate to include a frame portion having a planar surface, from which a plurality of leads project inwardly towards a physical quantity sensor chip, wherein tip ends of leads, which are arranged to encompass the physical quantity sensor chip, are disposed in a prescribed plane that is inclined with respect to the planar surface at a prescribed angle.