Heat-dissipation device

Abstract

A heat-dissipation device ( 1 ) is used for assembly on an outside portion of an electrically powered, heat-generating device (e.g., a notebook 6 ) for dissipation of heat produced thereby. The heat-dissipation device includes a fan ( 30 ), a thermo-electric cooler ( 20 ) disposed adjacent the fan, a processing unit ( 40 ) electrically connected with the thermo-electric cooler and the fan for controlling them, and an electrical connector ( 50 ) electrically connected with the processing unit. The connector is further electrically connected with the electrically powered, heat-generating device to be cooled. The processing unit controls the fan and the thermo-electric cooler according to signals transmitted from the electrically powered, heat-generating device, via the connector.

1 . A heat-dissipation device comprising: 
 a base;    a thermoelectric cooler disposed on an upper portion of the base, the thermoelectric cooler having a cooling face portion and a heat-dissipating face portion opposite to the cooling face portion;    a fan disposed on the base and near the cooling face portion of the thermo-electric cooler, the fan having an air-entrance end facing the cooling face portion of the thermo-electric cooler, an interspace defined between the air-entering end and the thermoelectric cooler;    an electrical connector disposed in a lower portion of the base, the connector having a port portion with at least one data bus terminal; and    a processing unit disposed in the base, the processing unit being electrically connected with the thermo-electric cooler, the fan, and the connector, the processing unit being configured for controlling the rotation speed of fan and the power of the thermo-electric cooler according to signals transmitted from the at least one data bus terminal of the connector.    
     
     
         2 . The heat-dissipation device as claimed in  claim 1 , further comprising a plurality of condensate pipes disposed between the fan and the thermo-electric cooler.  
     
     
         3 . The heat-dissipation device as claimed in  claim 1 , further comprising a heat sink disposed on the heat-dissipating face portion of the thermo-electric cooler, the heat sink having a plurality of heat fins arranged thereon in a parallel manner.  
     
     
         4 . The heat-dissipation device as claimed in  claim 1 , wherein the base has a cavity in the lower portion thereof, and the connector is rotatablely received in the cavity.  
     
     
         5 . The heat-dissipation device as claimed in  claim 4 , wherein a pair of recesses is defined in the base, each recess respectively communicating with the cavity, the connector further having a hinge located on an end thereof, the connector being received in the cavity via two opposite ends of the hinge, the two opposite ends of the hinge being received in the respective recesses of the base.  
     
     
         6 . The heat-dissipation device as claimed in  claim 1 , wherein at least one said data bus terminal is arranged in a standard pattern of USB or IEEE1394.  
     
     
         7 . The heat-dissipation device as claimed in  claim 1 , wherein the port portion further has at least one power terminal.  
     
     
         8 . A cooled heat-generating assembly comprising: 
 an electrically-powered device having an outside port;    a heat-dissipation device assembled onto the electrically-powered device, the heat-dissipation device comprising: 
 an electrical connector electrically connected with the outside port of the electrically-powered device;  
 a processing unit electrically connected with the connector;  
 a fan electrically connected with the processing unit, the fan facing the electrically-powered device and having an air-entrance end; and  
 a thermo-electric cooler connected with the processing unit and disposed beside the air-entrance end of the fan;  
   wherein the processing unit transmits control signals to the electrically-powered device via the connection between the connector and the outside port, the electrically-powered device transmits temperature signals back to the processing unit, and the processing unit controls the thermoelectric cooler and the fan according to the temperature signals.    
     
     
         9 . The cooled heat-generating assembly as claimed in  claim 8 , wherein the heat-dissipation device further comprises a heat sink disposed on a face of the thermo-electric cooler opposite to the fan.  
     
     
         10 . The cooled heat-generating assembly as claimed in  claim 9 , wherein the heat sink comprises a plurality of heat fins arranged in a parallel manner.  
     
     
         11 . The cooled heat-generating assembly as claimed in  claim 8 , wherein the heat-dissipation device further comprises a plurality of condensate pipes disposed between the fan and the thermoelectric cooler.  
     
     
         12 . A heat-dissipation device adapted for assembly on an outside portion of an electrically-powered device for dissipating heat generated thereby, the heat-dissipation device comprising: 
 a thermoelectric cooler with a cooling face portion and a heat-dissipating face portion opposite to the cooling face portion;    a fan disposed beside the cooling face portion of the thermoelectric cooler;    a heat sink disposed on the heat-dissipating face portion of the thermo-electric cooler,    a processing unit electrically connected with the thermo-electric cooler and the fan, the processing unit thereby being configured for controlling the thermo-electric cooler and the fan; and    an electrical connector electrically connected with the processing unit, the connector electrically connected with the electrically-powered device, the connector being adapted for applying signals and electricity received from the electrically-powered device to the heat-dissipation device.    
     
     
         13 . The heat-dissipation device as claimed in  claim 12 , further comprising a plurality of condensate pipes disposed between the air-entrance end of the fan and the cooling face portion of the thermo-electric cooler.  
     
     
         14 . The heat-dissipation device as claimed in  claim 12 , wherein the heat sink comprises a plurality of heat fins arranged in a parallel manner.  
     
     
         15 . The heat-dissipation device as claimed in  claim 12 , wherein the connector has at least one data bus terminal associated therewith.  
     
     
         16 . The heat-dissipation device as claimed in  claim 15 , wherein at least one said data bus terminal is selected from one of IEEE1394 and USB.