Thermosetting resin compounds

Abstract

This invention provides a thermosetting resin compound containing 25% or more by volume of anisotropic structure in the resin ingredient, wherein a structure constituting said anisotropic structure has a covalent bond and the maximum diameter of the structure is 400 nm or more. The resin ingredient of said thermosetting resin compound is preferably a hardened epoxy resin compound containing a mesogen-structured epoxy resin monomer and an epoxy resin hardening agent. The epoxy resin monomer in the thermosetting resin compound is preferably an epoxy resin monomer expressed by Formula (1) below E-M-S-M-E  (1) (where E, M, and S respectively indicate an epoxy group, a mesogen group, and a spacer). Therefore, this invention can provide a highly thermal conductive hardened thermosetting resin compound whose thermal conductivity is increased highly.

1 . A thermoset resin of a thermosetting compound, which contains 25% by weight or more of anistropic structures in the resin, wherein structural units constituting the anistropic structures have covalent bonds and have a maximum diameter of the structural units of 400 nm or more, and said resin contains at least one of metal, inorganic ceramics, organic powder, woven cloth, non-woven cloth, short fibers and long fibers.  
   
   
       2 . The thermoset resin according to  claim 1 , wherein the thermosetting compound comprises an epoxy resin monomer containing a mesogen-structure and an epoxy resin hardening agent.  
   
   
       3 . The themoset resin according to  claim 2 , wherein the epoxy resin monomer has a structure expressed by Formula (1) below,  
       E-M-S-M-E  (1) 
     wherein E, M and S respectively indicate an epoxy group, mesogen group and spacer.