Semiconductor substrate polishing methods and equipment

Abstract

According to one aspect of the present invention, a method of electrochemically polishing a semiconductor substrate may be provided. A semiconductor substrate processing fluid, having a plurality of abrasive particles therein, may be placed between the surface of the semiconductor substrate and the polish head. The polish head may be moved relative to the surface of the semiconductor substrate to cause the abrasive particles to polish the surface of the semiconductor substrate. According to a second aspect of the present invention, a method for electro-polishing a semiconductor substrate may be provided. A semiconductor substrate may be placed in an electrolytic solution. A surface of the semiconductor substrate may be contacted with at least one conductive member. A voltage may be applied across the electrolytic solution and the at least one conductive member. The at least one conductive member may be moved across the surface of the semiconductor substrate.

1 . A semiconductor substrate processing apparatus comprising: 
 a frame;    a liquid container connected to the frame to hold an electrolytic solution;    a semiconductor substrate support to support a semiconductor substrate while the semiconductor substrate is immersed in the electrolytic solution;    at least one conductive member moveably connected to the frame to contact and move across a surface of the semiconductor substrate while the semiconductor substrate is immersed in the electrolytic solution; and    a voltage supply, having a first electrode electrically connected to the at least one conductive member and a second electrode electrically connected to the electrolytic solution, to supply a voltage across the at least one conductive member and the electrolytic solution.    
   
   
       2 . The apparatus if  claim 1 , wherein the at least one conductive member has a member length and a member width, the member length being a multiple of the member width.  
   
   
       3 . The apparatus of  claim 2 , wherein the at least one conductive member has a first portion and a second portion, the second portion being substantially adjacent to the surface of the semiconductor substrate.  
   
   
       4 . The apparatus of  claim 3 , wherein the movement of the movement of at least one conductive member is in a direction extending substantially from the second portion to the first portion of the at least one conductive member.  
   
   
       5 . The apparatus of  claim 4 , wherein the at least one conductive member comprises a plurality of flexible metal wires.