US2006270249A1PendingUtilityA1

Semiconductor device and method of fabricating the same

Assignee: ASAKAWA KAZUHIKOPriority: Jul 7, 1999Filed: Aug 9, 2006Published: Nov 30, 2006
Est. expiryJul 7, 2019(expired)· nominal 20-yr term from priority
H10W 74/147H10W 20/494H10W 20/095H10W 20/081H10W 20/071H10W 20/069H10B 12/31H10B 12/05
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Claims

Abstract

A semiconductor device includes a semiconductor substrate which has a major surface, and a MOS transistor which has a gate and first and second diffusion regions and which is formed on the major surface. The semiconductor device also includes a laminated structure of an SOG layer, wherein the laminated structure is composed of a base layer and a surface layer formed on the base layer. The laminated structure is formed over the MOS transistor, and the surface layer is denser than the base layer.

Claims

exact text as granted — not AI-modified
1 . A semiconductor device comprising: 
 a semiconductor substrate which has a major surface;    an MOS transistor which has a gate and first and second diffusion regions, the MOS transistor formed on the major surface; and    a laminated structure of an SOG layer, said laminated structure composed of a base layer and a surface layer formed on the base layer, and over the MOS transistor, the surface layer being denser than the base layer.    
     
     
         2 . The semiconductor device of  claim 1 , wherein the laminated structure has a first contact hole defined therein, the first contact hole exposing the first diffusion region of the MOS transistor, 
 wherein a first conductive material is formed within the first contact hole.    
     
     
         3 . The semiconductor device of  claim 2 , wherein the first diffusion region is a source or a drain of the MOS transistor.  
     
     
         4 . The semiconductor device of  claim 2 , wherein the laminated structure has a second contact hole defined therein, the second contact hole exposing the second diffusion region of the MOS transistor, 
 wherein a second conductive material is formed within the second contact hole.    
     
     
         5 . The semiconductor device of  claim 4 , wherein the second diffusion region is a source or a drain of the MOS transistor.  
     
     
         6 . The semiconductor device of  claim 5 , wherein the first conductive material is a bit line and the second conductive material is an electrode of a capacitor.

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