Manufacturing method of composite sheet material using ultrafast laser pulses

Abstract

A patterned, multi-layered thin film structure is patterned using ultra-fast lasers and absorption spectroscopy without damaging underlying layers of the layered structure. The structure is made by selecting ablatable layers based on their thermal, strength and absorption spectra and by using an ultra-fast laser programmed with the appropriate wavelength (λ), pulse width (τ), spectral width (Δλ), spot size, bite size and fluence. The end structure may have features (such as vias, insulating areas, or inkjet printed areas) patterned in the last (top) layer applied or at deeper layers within the layered structure, and can be used as components of organic light emitting didoes (OLEDs) and organic thin film transistors (OTFTs). The method of the present invention includes determining the product's specifications, providing a substrate, selecting a layer, applying the layer, patterning the layer and determining if more layers need to be added to the multi-layered thin film structure.

1 .- 35 . (canceled)  
     
     
         36 . A completed multi-layered thin film structure produced by the method of claim  1 , the structure comprising: 
 first, second, and third thin-film layers, wherein the second layer is situated between the first and third layers;    at least one embedded conductive via formed in a layer other than an uppermost layer of said structure; and    a polished, transparent substrate of glass or plastic material,    wherein at least one of the first, second, and third thin-film layers is an organic thin film layer, and said via electrically connects said second layer with said substrate.    
     
     
         37 . A completed multi-layered thin film structure according to  claim 36 , the structure further comprising: 
 an insulation feature formed in a layer other than an uppermost layer of said structure; and    a printed trace created by applying inkjet printing to said third layer, wherein said third layer is situated between the second layer and said substrate,    wherein said insulation feature electrically insulates material used to isolate layers of the multi-layered thin film structure.