Semiconductor device modules, semiconductor devices, and microelectronic devices

Abstract

Supports ( 40 ) of microelectronic devices ( 10 ) are provided with underfill apertures ( 60 ) which facilitate filling underfill gaps ( 70 ) with underfill material ( 74 ). The underfill aperture may have a longer first dimension ( 62 ) and a shorter second dimension ( 64 ). In some embodiments, a method of filling the underfill gap ( 70 ) employs a removable stencil ( 80 ). If so desired, a stencil ( 80 ) can be used to fill multiple underfill gaps through multiple underfill apertures in a single pass.

1 - 13 . (canceled)  
     
     
         14 . A semiconductor device module, comprising: 
 a support having a mounting surface, a component surface, a plurality of component terminal arrays at the component surface in which individual component terminal arrays are configured to be associated with an individual semiconductor die, and a plurality of elongated slots through the support from the mounting surface to the component surface, wherein individual slots are associated with individual component terminal arrays;    a plurality of semiconductor dies, wherein the individual dies have a front side spaced apart from the component surface by an underfill gap, a backside, and a die terminal array at the front side, and wherein the individual die terminal arrays are electrically connected to corresponding individual component terminal arrays; and    an underfill material at least substantially filling the underfill gaps between the dies and the component surface of the support.    
     
     
         15 . The module of  claim 14  wherein the semiconductor dies are the same type of dies.  
     
     
         16 . The module of  claim 14  wherein the semiconductor dies include first and second dies, and wherein the first dies are different than the second dies.  
     
     
         17 . The module of  claim 14  wherein the underfill material at least partially fills the elongated slots.  
     
     
         18 . The module of  claim 14  wherein the terminals of the die terminal arrays are juxtaposed to corresponding terminals of corresponding component terminal arrays, and wherein the module further comprises solder balls electrically connecting the die terminal arrays to corresponding component terminal arrays.  
     
     
         19 . The module of  claim 18  wherein the underfill material encases the solder balls.  
     
     
         20 . The module of  claim 14  wherein the die terminal arrays and the individual corresponding component terminal arrays have common configurations, and wherein the module further comprises electrical connectors in the underfill gaps extending between the die terminal arrays and corresponding component terminal arrays.  
     
     
         21 . The module of  claim 20  wherein the underfill material encases the electrical connectors.  
     
     
         22 . The module of  claim 14 , further comprising electrical connectors between the die terminals and corresponding component terminals, and wherein the underfill material encapsulates the electrical connectors while at least substantially filling the underfill gaps.  
     
     
         23 . A semiconductor device, comprising: 
 a semiconductor die having a front side, a backside, an integrated circuit, and a first terminal array at the front side;    a first support having a component surface, a mounting surface, a second terminal array at the component surface electrically coupled to the first terminal array of the die, a third terminal array at the mounting surface, and a first aperture through the first support from the component surface to the mounting surface, the first aperture having a first dimension and a second dimension different than the first dimension, and the front side of the die being spaced part from the component surface by a first underfill gap;    a second support having a terminal surface, a fourth terminal array at the terminal surface electrically coupled to the third terminal array of the first support, and a second aperture, wherein the mounting surface of the first support is spaced apart from the terminal surface of the second support by a second underfill gap; and    an underfill material at least substantially filling the first underfill gap, the first aperture and the second underfill gap.    
     
     
         24 . The semiconductor device of  claim 23 , further comprising first electrical connectors electrically connecting the first terminal array to the second terminal array and second electrical connectors electrically connecting the third terminal array to the fourth terminal array.  
     
     
         25 . The semiconductor device of  claim 24  wherein the underfill material encapsulates the first and second electrical connectors.  
     
     
         26 . The semiconductor device of  claim 24  wherein the underfill material includes a first underfill material at least substantially filling the first underfill gap and a second underfill material at least substantially filling the second underfill gap.  
     
     
         27 . The semiconductor device of  claim 24  wherein the first and second electrical connectors comprise solder balls.  
     
     
         28 . The semiconductor device of  claim 23  wherein the second support comprises a printed circuit board, and wherein the semiconductor device further comprises a plurality of semiconductor dies carried by the printed circuit board.  
     
     
         29 . A microelectronic device, comprising: 
 a microelectronic die having a front side, a backside, and a first terminal array at the front side;    a first support having a component surface, a mounting surface, a second terminal array at the component surface electrically connected to the first terminal array, and an elongated aperture through the first support from the component surface to the mounting surface, wherein the front side of the die faces the component surface of the first support across an underfill gap; and    an underfill material at least substantially filling the underfill gap.    
     
     
         30 . The microelectronic device of  claim 29  wherein the aperture is configured to have one of an I-shape, a T-shape, a star shape, a U-shape or an L-shape.  
     
     
         31 . The microelectronic device of  claim 29  wherein the underfill gap is peripherally open.  
     
     
         32 . The microelectronic device of  claim 29 , further comprising: 
 a second support having a first side, a second side, and an opening through the second support from the first side to the second side, wherein the first support is spaced apart from the second support by a second gap; and    a plurality of electrical connectors electrically coupling the first terminal array to the second terminal array.    
     
     
         33 . The microelectronic device of  claim 32  wherein the underfill material at least substantially fills the underfill gap between the die and the first support and the second gap between the first support and the second support, and wherein the underfill material at least substantially encases the electrical connectors.  
     
     
         34 . The microelectronic device of  claim 33  wherein the underfill material includes a first underfill material between the die and the first support and a second underfill material between the first support and the second support.  
     
     
         35 . The microelectronic device of  claim 33  wherein the underfill material includes a first underfill material between the die and the first support and a second underfill material between the first support and the second support, and wherein the first underfill material has the same composition as the second underfill material.