Method and apparatus for wafer cleaning

Abstract

An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

1 . An apparatus for sequencing wet processing of individual wafers, comprising: 
 a plurality of single wafer process chambers each comprising: 
 a plurality of transducers positioned to transmit sonic energy to a non-device side of the wafer,  
 a plurality of wafer cartridges; and  
   a centrally located robot arm able to take wafers to and from the wafer process chambers and to and from the wafer cartridges.    
   
   
       2 . The apparatus of  claim 1 , further comprising: 
 means for providing an efficiency of at least 30% of the power applied to the transducers reaches the wafer.    
   
   
       3 . The apparatus of  claim 1 , wherein the acoustic energy is provided by acoustic wave transducers that generate a frequency=(velocity of sound in a wafer material)/(2) (a thickness of the wafer).  
   
   
       4 . The apparatus of  claim 1 , further comprising: 
 means for mounting one or more acoustic wave transducers; and    means for positioning the one or more acoustic wave transducers to be parallel to and facing a non-device side of the wafer.    
   
   
       5 . The apparatus of  claim 4 , further comprising: 
 means for flowing a liquid between the one or more acoustic wave transducers and the non-device side of the wafer.    
   
   
       6 . The apparatus of  claim 5  further comprising: 
 means for positioning the one or acoustic wave transducers onto a platter to provide 80% or greater acoustic coverage on the platter.    
   
   
       7 . A system for wet processing a wafer, comprising: 
 means for positioning and rotating the wafer in a process chamber;    a chemical source;    means for dispensing a first chemical onto a bottom side of the wafer;    means for dispensing a second chemical onto a topside of the wafer;    means to apply megasonic energy to the wafer; and    controlling electronics.    
   
   
       8 . The system of  claim 7 , wherein the process chamber is capable of providing an air flow past an annular ring of vents so as to pull chemicals and gasses off the wafer.