Methods and apparatus for providing fluid to a semiconductor device processing apparatus

Abstract

In a first aspect, a valve assembly is provided that includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to circulate the chemical to a chemical return; and (3) a second output adapted to output the chemical to the valve assembly output. The valve assembly also includes a second valve positioned downstream from the first valve. The second valve includes (1) an input adapted to receive deionized (DI) water; and (2) an output adapted to output DI water to the valve assembly output. A check valve is coupled between the second output of the first valve and the output of the second valve, and the first valve, second valve and check valve are included in a single manifold.

1 . A semiconductor device processing apparatus comprising: 
 a polishing device; and    a valve assembly coupled to the polishing device and adapted to provide fluid to the polishing device, the valve assembly including: 
 a valve assembly output adapted to output at least one of DI water and a chemical to the polishing device;  
 a first valve comprising: 
 a first input adapted to receive the chemical;  
 a first output adapted to circulate the chemical to a chemical return; and  
 a second output adapted to output the chemical to the valve assembly output;  
 
 a second valve positioned downstream from the first valve comprising: 
 an input adapted to receive deionized (DI) water; and  
 an output adapted to output DI water to the valve assembly output; and  
 
 a check valve coupled between the second output of the first valve and the output of the second valve;  
 wherein the first valve, second valve and check valve are included in a single manifold.  
   
     
     
         2 . The semiconductor device processing apparatus of  claim 1  wherein: 
 the polishing device includes a scrubber device; and    the valve assembly is adapted to selectively deliver the chemical and DI water to the scrubber device.    
     
     
         3 . The semiconductor device process apparatus of  claim 2  wherein the both the scrubber device and the valve assembly are included within the polishing device.  
     
     
         4 . The semiconductor device process apparatus of  claim 1  wherein the first valve further comprises a manual override switch.  
     
     
         5 . The semiconductor device process apparatus of  claim 1  wherein at least one of the first and second valves is a pneumatically-actuated valve.  
     
     
         6 . The semiconductor device process apparatus of  claim 1  wherein one or more DI water path within the valve assembly includes no dead leg.