Wafer level electro-optical simiconductor manufacture fabrication mechanism and a method for the same

Abstract

A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

1 - 10 . (canceled)  
   
   
       11 . A wafer-level electro-optical semiconductor manufacture method, further comprising: 
 preparing a wafer with a preservation position for covering the jointed crystal grains;    daubing a plurality of conducting materials onto the preservation position;    stacking electro-optical semiconductor onto the conductive materials of the wafer;    packaging the electro-optical semiconductor with high polymeric materials to produce a semi-finished product;    cutting the semi-finished product to form an electro-optical semiconductor mechanism.    
   
   
       12 . The wafer-level electro-optical semiconductor manufacturing method as in  claim 11 , wherein the wafer has over-voltage protection, voltage regulation, current regulation, noise filtering and electrical static discharge circuits all electrically connected to the preservation position.