3D optoelectronic micro system

Abstract

A 3D micro optical switching system (3D-MOSS) is fabricated by dividing an optical switching system into several blocks, creating optoelectronic layers where optical switches or tunable filters in each block are disposed, laminating the optoelectronic layers by connecting the layers with optical connections. The fabrication process includes a first step of selectively exposing an adhesive bond whose adhesive strength changes by exposure, a second step of contacting the selectively-exposed adhesive bond with a thin-film device array on a first substrate, and a third step of selectively ring part of thin-film devices in the thin-film device array from the first substrate onto the selectively-exposed adhesive bond in accordance with an exposure pattern.

1 . A 3D micro optical switching system, comprising: 
 a plurality of optical switches or tunable filters; and    an optical connection for connecting the optical switches or the tunable filters,    wherein the optical switching system comprises a single or a plurality of optoelectronic layers where the optical switches or the tunable filters are embedded, and    at least part of the optical connection comprises an optical connection between the optoelectronic layers.    
   
   
       2 . A 3D micro optical switching system according to  claim 1 , wherein at least one of the optoelectronic layers comprises at least one selected from a LSI, an IC, an optical switch, a tunable filter, a waveguide, a micro mirror, a micro filter, a micro lens, a micro prism, a vertical waveguide, a semiconductor laser, a photo detector, an optical memory, an optical amplifier, and a photonic crystal with a thickness of 100 μm and less.  
   
   
       3 . A 3D micro optical switching system according to  claim 1 , wherein the optical connection between the layers comprises at least one selected from a micro mirror, a micro filter, a micro lens, a micro prism, and a vertical waveguide.  
   
   
       4 . A 3D optoelectronic microsystem, at least partly comprising: 
 a lamination structure of a layer having a thin film of an integrated circuit (IC) and an optoelectronic layer having a thin film of an optical device,    wherein a pitch of terminals of the integrated circuit connected to the optical device is smaller than a pitch of terminals on an opposite side of the optical device.    
   
   
       5 . A 3D optoelectronic microsystem according to  claim 4 , wherein the optical device comprises an optical switch and/or a tunable filter, and the IC comprises an electronic circuit for driving the optical switch and/or the tunable filter.  
   
   
       6 . A 3D optoelectronic microsystem according to  claim 5 , wherein the optical switch comprises a variable well optical IC at least partly having a slab waveguide with a nonlinear optical effect and having a strip electrode array or a prism electrode array formed in a near proximity to the slab waveguide.  
   
   
       7 . An all optical 3D optoelectronic microsystem, comprising: 
 a first optoelectronic layer including an all-optical switch that uses light to switch light;    a second optoelectronic layer for diffusing control light for driving the all-optical switch; and    an optical z-connection for transferring the control light between the second optoelectronic layer and the first optoelectronic layer.    
   
   
       8 . A 3D micro optical switching system, comprising a plurality of optical switches or tunable filters; and 
 an optical connection having a vertical waveguide, for connecting the optical switches or the tunable filters,    wherein the optical switching system comprises a single or a plurality of optoelectronic layers where the optical switches or the tunable filters are disposed, and    at least part of the optical connection comprises an optical connection between the optoelectronic layers which passes through an adjacent optoelectronic layer.