Method of forming plated pattern and method of manufacturing thin film magnetic head

Abstract

The method of forming a plated pattern is capable of securely narrowing and miniaturizing a resist pattern, which has been hydrophilic-treated, without widening and deforming the resist pattern. The method comprises the steps of: covering a surface of a plating seed layer with resist; exposing and developing the resist so as to form a resist pattern having a concave part; executing a hydrophilic treatment of the resist pattern; piling a metal in the concave part of the resist pattern by plating; removing the resist pattern; and removing an exposed part of the plating seed layer. The plating seed layer is a volatile metal layer made of a metal, which is oxidized during the hydrophilic treatment, and an oxide of the metal constituting the volatile metal layer has volatility.

1 . A method of forming a plated pattern, 
 comprising the steps of:    covering a surface of a plating seed layer with resist;    exposing and developing the resist so as to form a resist pattern having a concave part, which has a prescribed pattern and in which the plating seed layer is exposed as an inner bottom face;    executing a hydrophilic treatment of the resist pattern;    piling a metal in the concave part of the resist pattern by plating;    removing the resist pattern; and    removing an exposed part of the plating seed layer,    wherein the plating seed layer is a volatile metal layer made of a metal, which is oxidized during the hydrophilic treatment, and an oxide of the metal constituting the volatile metal layer has volatility.    
   
   
       2 . The method according to  claim 1 , 
 wherein the metal constituting the volatile metal layer is ruthenium.    
   
   
       3 . A method of manufacturing a thin film magnetic head, 
 wherein a part of the thin film magnetic head is formed by the steps of: 
 covering a surface of a plating seed layer with resist;  
 exposing and developing the resist so as to form a resist pattern having a concave part, which has a prescribed pattern and in which the plating seed layer is exposed as an inner bottom face;  
 executing a hydrophilic treatment of the resist pattern;  
 forming a magnetic film in the concave part of the resist pattern by plating;  
 removing the resist pattern; and  
 removing an exposed part of the plating seed layer, and  
   wherein the plating seed layer is a volatile metal layer made of a metal, which is oxidized during the hydrophilic treatment, and an oxide of the metal constituting the volatile metal layer has volatility.    
   
   
       4 . The method according to  claim 3 , 
 wherein the part of the thin film magnetic head is a main magnetic pole of a vertical magnetic recording head.    
   
   
       5 . The method according to  claim 3 , 
 wherein the part of the thin film magnetic head is an end magnetic pole of an upper magnetic pole of a horizontal magnetic recording head.    
   
   
       6 . The method according to  claim 5 , 
 wherein thickness of the volatile metal layer is equal to a distance between the end magnetic pole of the upper magnetic pole and an end magnetic pole of a lower magnetic pole.    
   
   
       7 . The method according to  claim 3 , 
 wherein the metal constituting the volatile metal layer is ruthenium.