Methods for application of adhesive tape to semiconductor devices

Abstract

A method and apparatus for application of adhesive tape to semiconductor devices are disclosed. A first adhesively coated tape material length is supplied to a first die associated with a cutting and application mechanism. A second length of adhesively coated tape material is also provided to a second die of the cutting and application mechanism. A plurality of LOC leadframes is supplied sequentially through the application structure to apply a first decal cut from the first tape material to a first die site at a first location and to apply a second decal cut from the second tape material to a second die site at a second location.

1 . A system for applying adhesively coated material to a portion of a die site of a leadframe of a plurality of leadframes for semiconductor devices, said system comprising: 
 a first source for supplying a first length of adhesively coated material at a first location of said die site of said leadframe;    a second source for supplying a second length of adhesively coated material at a second location of said die site of said leadframe; and    application apparatus configured to receive said plurality of leadframes for semiconductor devices in a leadframe-by-leadframe sequence, to receive said first length of adhesively coated material at the first location of said die site and to receive said second length of adhesively coated material at the second location of said die site, said application means having cutting means for cutting a first increment of said first length of adhesively coated material and applying said first increment to the first location of said die site of said leadframe of said plurality of leadframes at and for cutting a second increment of said second length of adhesively coated material and applying said second increment to the second location of said die site of said leadframe of said plurality of leadframes after the leadframe has been indexed to the second location.    
   
   
       2 . The system of  claim 1 , further comprising: 
 cutting structure including:    a first die located at the first location, the first die movable relative to a first cutting structure configured to receive said first length of said adhesively coated material; and    operation apparatus positioned to move said first die relative to said first cutting structure to form said first increment and to urge said first increment toward and against said first location of said die site of said leadframe of said plurality of leadframes for semiconductor devices.    
   
   
       3 . The system of  claim 2 , wherein said structure further includes: 
 a second die located at the second location, the second die movable relative to a second cutting structure configured to receive said second length of said adhesively coated material; and    wherein said operation apparatus is positioned to move said second die relative to said second cutting structure to form said second increment and to urge said second increment towards and against the second location of said die site of said leadframe of said plurality of leadframes for semiconductor devices.    
   
   
       4 . The system of  claim 3 , wherein said first source includes: 
 a first adhesively coated material supply configured to supply said first length.    
   
   
       5 . The system of  claim 4 , wherein said second source includes: 
 a second adhesively coated material supply configured to supply said second length.    
   
   
       6 . The system of  claim 3 , further comprising: 
 indexing apparatus including: 
 apparatus configured to urge said plurality of leadframes for semiconductor devices to move relative to said application apparatus.  
   
   
   
       7 . The system of  claim 2 , wherein said operation apparatus includes: 
 a first die moving mechanism positioned relative to said first die for urging said die to move toward a leadframe of said plurality of leadframes, said first die moving mechanism being connected to said control means to receive operation signals therefrom to cause said first die moving mechanism to move said first die toward said leadframe of said plurality of leadframes.    
   
   
       8 . The system of  claim 7 , wherein said first die moving mechanism includes: 
 a solenoid mechanism positioned to urge said die to move.    
   
   
       9 . The system of  claim 3 , wherein said application apparatus includes: 
 a block positioned opposite said first die with said leadframe of said plurality of leadframes positioned between said block and said first die to inhibit movement of said leadframe of said plurality of leadframes upon movement of said first die against said leadframe of said plurality of leadframes.    
   
   
       10 . The system of  claim 9 , wherein said block is sized for positioning opposite both said first die and said second die with a leadframe of said plurality of leadframes positioned between said block and said first die and with a leadframe of said plurality of leadframes positioned between said block and said second die to inhibit movement of said leadframe of said plurality of leadframes upon movement of said first die and said second die against said leadframe of said plurality of leadframes.  
   
   
       11 . The system of  claim 9 , wherein said block includes: 
 heating apparatus to heat said block and said leadframe and said first increment and said second increment upon urging of same against said leadframe.    
   
   
       12 . The system of  claim 3 , wherein said application apparatus includes: 
 first guide for said first length and a second guide for said second length.    
   
   
       13 . The system of  claim 3 , wherein said first cutting structure and said second cutting structure are connected.  
   
   
       14 . The system of  claim 3 , wherein said operation apparatus is configured to urge said first die and said second die to move separately and independently.  
   
   
       15 . The system of  claim 6 , wherein said plurality of leadframes includes a first leadframe, a middle leadframe and a last leadframe, and wherein said indexing apparaatus operates to urge said first leadframe to the first location of said die site with its first location positioned relative to said die site to receive said first increment upon activation of said first source and with its second location positioned to not be contacted by said second die, wherein said control means sends operation signals to activate said first source to supply said first length to said first cutting structure and to not activate said second source.  
   
   
       16 . The system of  claim 15 , wherein said indexing apparatus operates to urge said middle leadframe to have its first location of said die site positioned relative to said first die to receive said first increment upon activation of said first source and said first die and to thereafter urge said middle leadframe to have its second location of said die site positioned relative to said second die to receive said second increment upon activation of said second source and said second die, and wherein said control apparatus sends operation signals to activate said first source to supply said first length to said first cutting structure and to activate said second source to supply said second length to said second cutting structure.  
   
   
       17 . The system of  claim 16 , wherein said indexing apparatus operates to urge said last leadframe to be positioned with its second location of said die site positioned relative to said second die to receive said second increment upon activation of said second source and said second die and with is first location of said die site positioned to not be contacted by said first die, and wherein said operation apparatus sends operation signals to activate said second source to supply said second length to said second cutting structure and to not activate said first source.  
   
   
       18 . Apparatus for application of tape to a die site of an LOC leadframe of a plurality of LOC leadframes, said apparatus comprising: 
 a base;    a block positioned proximate said base and spaced therefrom for an LOC leadframe to pass closely and freely therebetween;    supply structure positioned relative to said base to supply a first tape length at a first location of said die site of said leadframe and a second tape length at a second location of said die site of said leadframe to said base;    indexing structure for moving each LOC leadframe of said plurality of LOC leadframes relative to said base from the first location of said die site to the second location of said die site;    application structure mechanically associated with said base for cutting said first tape length into a first tape decal and applying said first tape decal to the first location of said die site of said LOC leadframe positioned between said base and said block at the first location and for cutting said second tape length into a second tape decal and applying said second decal to the second location of said die site on said LOC leadframe positioned between said base and said block at the second location; and    control structure connected to said application means for causing said application structure to cut said first tape length into a first tape decal and for applying said first tape decal to a first location of said die site on an LOC leadframe and to cut said second tape length into a second decal and for applying said second decal to a second location of said die site on said LOC leadframe positioned between said base and said block at the second location.    
   
   
       19 . The apparatus of  claim 18 , wherein said application structure includes a first die positioned to cut said first tape length to form said first tape decal and to urge said first tape decal to said first location of said die site, said block positioned relative to said first die to inhibit movement of said LOC leadframe of said plurality of LOC leadframes upon movement of said first die against said leadframe of said plurality of LOC leadframes.  
   
   
       20 . The apparatus of  claim 17 , wherein said application structure includes a second die positioned to cut said second tape length to form said second tape decal and to urge said second tape decal to the second location of said die site, and wherein said block is sized for positioning opposite both said first die and said second die with a leadframe of said plurality of LOC leadframes positioned between said block and said first die and with a leadframe of said plurality of leadframes positioned between said block and said second die to inhibit movement of said leadframe of said plurality of leadframes upon movement of said first die and said second die against said leadframe of said plurality of leadframes.  
   
   
       21 . The apparatus of  claim 20 , wherein said block includes: 
 heat means to heat said block and said LOC leadframe and said first increment and said second increment upon urging of same against said LOC leadframe.    
   
   
       22 . The apparatus of  claim 21 , wherein said application structure includes: 
 first guide for said first length; and    a second guide for said second length.    
   
   
       23 . The apparatus of  claim 22 , wherein said indexing structure includes structure configured to urge said plurality of LOC leadframes to move relative to said application structure.  
   
   
       24 . The apparatus of  claim 23 , wherein said application structure includes a first die moving mechanism positioned relative to said first die for urging said die to move toward an LOC leadframe of said plurality of LOC leadframes, said first die moving mechanism being connected to said control structure to receive operation signals therefrom to cause said first die moving mechanism to move said first die toward said LOC leadframe of said plurality of LOC leadframes.  
   
   
       25 . The apparatus of  claim 24 , wherein said first die moving mechanism includes a solenoid mechanism positioned to urge said die to move.  
   
   
       26 . A method of attaching tape to a plurality of leadframes comprising 
 providing indexing apparatus to supply a plurality of leadframes in leadframe-by-leadframe sequence, each leadframe of said plurality of leadframes having a first location of a die site of a leadframe of said plurality of leadframes for receiving a first piece of tape of a first adhesively coated material and a second location of a die site for receiving a second piece of tape of a second adhesively coated material;    providing application apparatus to receive said first adhesively coated material at the first location of a die site, to receive said second adhesively coated material at the second location, and to receive said plurality of LOC leadframes in leadframe-by-leadframe sequence, said application apparatus having cutting apparatus for cutting and applying a first piece of tape of said first adhesively coated material to the first location of a die site and for cutting and applying a second decal of said second adhesively coated material to the second location of a die site;    operating a first source of a first adhesively coated material to supply a length of said first adhesively coated material to said application apparatus;    operating a second source of a second adhesively coated material to supply a length of said second adhesively coated material to said application apparatus;    operating said application apparatus to cut said first decal from said length of first adhesively coated material and to apply said first piece of tape to the first location of the die site of each leadframe of said plurality of LOC leadframes of said plurality of LOC leadframes at the first location;    operating said second source to supply a length of said second adhesively coated material to said application apparatus; and    operating said application means to cut said second piece of tape from said length of second adhesively coated material and to apply said second decal to a second site of each of said leadframes of said plurality of leadframes at the second location.    
   
   
       27 . The method of  claim 26 , wherein the application apparatus includes a first applicator and the second applicator includes a die configured for cutting a portion of adhesively coated material from the source of adhesively coated material.  
   
   
       28 . The method of  claim 26 , further including providing a block spacedly positioned from the application apparatus wherein each leadframe of the plurality is positioned intermediate the block and the first and second applicators during operation of the application apparatus.  
   
   
       29 . The method of  claim 28 , wherein the block is heated during the operation of the application apparatus.  
   
   
       30 . The method of  claim 27 , wherein a source of adhesively coated material comprises providing a respective supply of adhesively coated material for the first and second applicators.  
   
   
       31 . The method of  claim 27 , wherein providing a source of adhesively coated material further includes providing a drive roller assembly for controllably supplying the first and second applicators with a quantity of adhesively coated material.  
   
   
       32 . The method of  claim 30 , wherein providing a source of adhesively coated material further includes providing a drive roller assembly for each respective supply of adhesively coated material for each of the first and second applicators for controllably supplying each of the first and second applicators with a quantity of adhesively coated material.  
   
   
       33 . The method of  claim 31 , wherein operating the source of adhesively coated material comprise rotating the drive roller assembly to displace a quantity of the adhesively coated material into engagement with each of the first and second applicators.  
   
   
       34 . The method of  claim 26 , further including providing a controller for intercooperating the operation of the source of adhesively coated material and the indexing apparatus.  
   
   
       35 . The method  claim 34 , further including operating the controller to synchronize the operation of the source of adhesively coated material and the indexing apparatus.  
   
   
       36 . The method of  claim 34 , wherein providing the controller further includes incorporating the controller with the application apparatus.  
   
   
       37 . The method of  claim 36 , further including operating the controller to synchronize the operation of the source of adhesively coated material, the indexing apparatus, and the application apparatus.  
   
   
       38 . The method of  claim 30 , wherein providing the source of adhesively coated material comprises a source of thermal setting adhesively coated material.