Technique for accommodating electronic components on a multilayer signal routing device

Abstract

A technique for accommodating electronic components on a multilayer signal routing device is disclosed. In one particular exemplary embodiment, the technique may be realized as a multilayer signal routing device comprising a primary surface and a secondary surface. The primary surface may have a plurality of electrically conductive pads formed thereon, wherein a group of the plurality of electrically conductive pads is in respective electrical connection with a group of electrically conductive micro-vias formed in the multilayer signal routing device. The secondary surface may have a channel formed thereon coinciding with the location of the group of electrically conductive micro-vias, wherein the channel has a channel area on the secondary surface for accommodating an electronic component mounted on the secondary surface.

1 . A-multilayer signal routing device comprising: 
 a primary surface having a plurality of electrically conductive pads formed thereon, a group of the plurality of electrically conductive pads in respective electrical connection with a group of electrically conductive micro-vias formed in the multilayer signal routing device; and    a secondary surface having a channel formed thereon coinciding with the location of the group of electrically conductive micro-vias, the channel having a channel area on the secondary surface for accommodating an electronic component mounted on the secondary surface.    
   
   
       2 . The multilayer signal routing device of  claim 1 , wherein the secondary surface has an electrically conductive pad formed thereon within the channel.  
   
   
       3 . The multilayer signal routing device of  claim 2 , wherein the secondary surface has an electrically conductive trace formed thereon, the electrically conductive trace in electrical connection with the electrically conductive pad formed on the secondary surface.  
   
   
       4 . The multilayer signal routing device of  claim 2 , wherein the electronic component is mounted on the secondary surface within the channel in electrical connection with the electrically conductive pad formed on the secondary surface.  
   
   
       5 . The multilayer signal routing device of  claim 1 , wherein the channel has at least one of a vertical, horizontal, and diagonal orientation portion along the secondary surface of the multilayer signal routing device.