Wallboard tape and method of using same

Abstract

A means and method for simplifying the covering of elongated wallboard joints formed by the abutting of adjacent wallboards using an improved resin impregnated water-activated adhesive tape containing mold and mildew inhibitors, and having air venting perforations extending between first and second planar surfaces applied directly over the joint. Following which an applied single coat of plaster composition is used to conceal the tape.

1 . An improved tape for covering elongated joints in gypsum and other type wallboards comprising: a fibrous tape having a resin-impregnated body defining first and second planar surfaces; said body having air-conducting perforations extending therethrough; and a water-soluble, water-activated adhesive layer applied to one of said first and second surfaces, said layer being in communication with said air-conducting perforations, whereby said adhesive layer may dry through said air perforations in the process of drying after installation over a wall joint, said resin impregnated body remaining relatively non-moisture absorbent during the wetting of said adhesive layer.  
   
   
       2 . A method for covering an elongated wall joint between a pair of abutting wallboards forming a continuous interior of a building structure comprising the steps of: 
 a) providing an elongated length of wallboard tape of width sufficient to overlie said joint, said tape including a resin impregnated fibrous base having air-conducting perforations extending between first and second planar surfaces thereof, and a layer of water-soluble, water-activated adhesive containing mold and mildew inhibitors applied to one of said surfaces:    b) wetting an exposed surface of said layer of adhesive;    c) pressing said last-mentioned surface of said tape into smooth contact with adjacent areas of said pair of wallboards to overlie said joint to adhere said adhesive layer to said adjacent areas;    d) allowing said adhesive layer to dry by evaporation of moisture through said air-conducting perforations; and    e) applying a single coat of plaster compound over said tape and areas adjacent said joint.    
   
   
       3 . The method in accordance with  claim 2;  in which said adhesive is wetted prior to the application of said joint.  
   
   
       4 . The method in accordance with  claim 2 , in which said adhesive is wetted by wetting of the adjacent surfaces of said pair of wallboards.  
   
   
       5 . The method in accordance with  claim 1 , in which said mold and mildew inhibitors include a liquid polysiloxane.  
   
   
       6 . The method in accordance with  claim 5 , in which said polysiloxane is mixed with said adhesive in a proportion of less than five percent by volume.