Method of forming a stack of packaged memory dice

Abstract

A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devices and external circuitry.

1 . An integrated circuit semiconductor device assembly, comprising: 
 a board;    a multiconductor port supported by the board;    a stack including a plurality of bare integrated circuit semiconductor devices supported by the board, each of the plurality of integrated circuit semiconductor devices including, in turn, a plurality of terminals on a surface thereof; and    a plurality of multiconductor insulating assemblies including multiple conductive sections and flexible insulating material, the conductive sections providing conductive paths between a portion of the terminals of the integrated circuit semiconductor devices and the multiconductor port.    
   
   
       2 . The assembly of  claim 1 , wherein each multi-conductor insulating assembly includes tape.  
   
   
       3 . The assembly of  claim 2 , wherein the tape is from a spool.  
   
   
       4 . The assembly of  claim 1 , wherein each multi-conductor insulating assembly includes epoxy material.  
   
   
       5 . The assembly  claim 1 , wherein an adjacent bare integrated circuit semiconductor device of the plurality of bare integrated circuit semiconductor devices of the stack is adhesively secured to another adjacent integrated circuit semiconductor device.  
   
   
       6 . The assembly of  claim 1 , wherein each multi-conductor insulating assembly is positioned between two bare integrated circuit semiconductor devices of the plurality of bare integrated circuit semiconductor devices.  
   
   
       7 . The assembly of  claim 1 , wherein there are a first number of bare integrated circuit semiconductor devices in the plurality of bare integrated circuit semiconductor devices, each bare integrated circuit semiconductor device including a first number of the terminals, and wherein each multi-conductor insulating assembly includes a first number of groups of conductive sections, each group of the first number of groups of conductive sections including a first number of conductive sections therein.  
   
   
       8 . The assembly of  claim 1 , wherein there are a first number of bare integrated circuit semiconductor devices of the plurality of bare integrated circuit semiconductor devices, each integrated circuit semiconductor device including a first number of the terminals, and wherein each multi-conductor insulating assembly includes a first number of conductive sections therein.  
   
   
       9 . The assembly of  claim 1 , wherein at least one conductive path of a multiple conductive section of the multiple conductive sections contacts the same terminal of each bare integrated circuit semiconductor device of the plurality of bare integrated circuit semiconductor devices.  
   
   
       10 . The assembly of  claim 1 , wherein a plurality of conductive paths of a multiple conductive section of the multiple conductive sections contact the same terminal of each bare integrated circuit semiconductor device of the plurality of bare integrated circuit semiconductor devices so that corresponding terminals from different individual bare integrated circuit semiconductor devices of the plurality of bare integrated circuit semiconductor devices are connected to each other.  
   
   
       11 . The assembly of  claim 1 , wherein the multi-conductor port includes a plurality of connectors for connection to the conductive paths of the multiple conductive sections of each multi-conductor insulating assembly.  
   
   
       12 . The assembly of  claim 1 , wherein the terminals are formed from tape automated bonding (TAB) tape.  
   
   
       13 . The assembly of  claim 1 , wherein the board is a printed circuit board.  
   
   
       14 . The assembly of  claim 1 , wherein the bare integrated circuit semiconductor devices include flip chip integrated circuit semiconductor devices including solder bumps thereon.  
   
   
       15 . An integrated circuit semiconductor device assembly, comprising: 
 a board;    a multiconductor port supported by the board;    a stack including a plurality of packaged integrated circuit semiconductor devices supported by the board, each of the plurality of integrated circuit semiconductor devices including, in turn, a plurality of terminals located on opposing sides thereof; and    a multiconductor insulating assembly surrounding at least two adjacent sides of the stack of a plurality of integrated circuit packages, the multiconductor insulating assembly including multiple conductive sections and flexible insulating material, the conductive sections providing conductive paths between a portion of the terminals of the integrated circuit semiconductor devices and the multiconductor port.    
   
   
       16 . The assembly of  claim 15 , wherein the contact pads of the first and second multi-conductor insulating assemblies of the plurality of multi-conductor insulating assemblies are connected to a multi-conductor port supported by the support surface.  
   
   
       17 . The assembly of  claim 15 , wherein the multi-conductor insulating assemblies include tape.  
   
   
       18 . The assembly of  claim 15 , wherein each multi-conductor insulating assembly of the plurality of the multi-conductor insulating assemblies include epoxy.  
   
   
       19 . A method of forming a stack of integrated circuit semiconductor devices comprising: 
 providing a multi-port connector having a port;    providing a board;    adhering a first integrated circuit semiconductor device having a plurality of terminals thereon to the board;    adhering a second integrated circuit semiconductor device having a plurality of terminals thereon to the first integrated circuit semiconductor device; and    connecting a multiconductor flexible insulating assembly between at least one terminal of a first type on the first integrated circuit semiconductor device to at least one terminal of the same type terminal of the second integrated circuit semiconductor device and a terminal of the port of the multiconductor port connector.    
   
   
       20 . The method of  claim 19 , wherein the multi-conductor insulating assembly includes tape.  
   
   
       21 . The method of  claim 19 , wherein the multi-conductor insulating assembly is includes epoxy.  
   
   
       22 . The method of  claim 19 , wherein the multi-conductor insulating assembly is extruded.  
   
   
       23 . The method of  claim 19 , wherein the multi-conductor insulating assembly is an extrusion.  
   
   
       24 . The method of  claim 19 , wherein the extrusion is cut to form the multi-conductor insulating assembly.  
   
   
       25 . The method of  claim 24 , wherein at least one conductor is exposed during the cutting of the extrusion to form the multi-conductor insulating assembly.  
   
   
       26 . The method of  claim 24 , wherein at least two conductors are exposed during the cutting of the extrusion to form the multi-conductor insulating assembly.  
   
   
       27 . The method of  claim 19 , wherein the multi-conductor insulating assembly includes a plurality of conductors separated by insulating material.