Electronic device with improved cooling mechanism

Abstract

An electronic device includes a substrate, a processor, and a cooling mechanism. The processor is disposed on the substrate. The cooling mechanism includes a conductive medium, a cooling plate and a protrusion. The conductive medium contacts the processor. The cooling plate contacts the conduction medium. The protrusion protruding from the cooling plate connects the substrate to define and maintain a distance between the substrate and the cooling plate. Thus, the contact between the processor, the conductive medium, and the cooling plate are tightly maintained.

1 . An electronic device, comprising: 
 a substrate;    a processor disposed on the substrate; and    a cooling mechanism abutting the processor, the cooling mechanism including:    a conductive medium touching the processor;    a cooling plate touching the conductive medium; and    a protrusion protruding from the cooling plate and connecting the substrate to define and maintain a distance between the substrate and the cooling plate.    
   
   
       2 . The electronic device according to  claim 1 , wherein the protrusion has a predetermined height for defining the distance between the substrate and the cooling plate.  
   
   
       3 . The electronic device according to  claim 2 , wherein the cooling plate substantially parallels the substrate and the protrusion is substantially perpendicular to the cooling plate.  
   
   
       4 . The electronic device according to  claim 2 , further comprising a fasten means, which penetrates the substrate and engages with the protrusion to fasten the cooling plate to the substrate.  
   
   
       5 . The electronic device according to  claim 4 , wherein the fasten means comprises a screw.  
   
   
       6 . The electronic device according to  claim 2 , wherein the protrusion further includes a bulge which penetrates and engages with the substrate.  
   
   
       7 . The electronic device according to  claim 2 , wherein the protrusion connects to a geometrical center of the substrate.  
   
   
       8 . The electronic device according to  claim 2 , wherein the protrusion connects to the substrate at a position adjacent to the processor.  
   
   
       9 . The electronic device according to  claim 1 , wherein the protrusion further comprises a groove for receiving one end of the substrate to define the distance between the substrate and the cooling plate.  
   
   
       10 . The electronic device according to  claim 9 , further comprising an auxiliary protrusion having a groove for receiving the other end of the substrate.  
   
   
       11 . The electronic device according to  claim 1 , wherein the electronic device comprise an optical disc drive.  
   
   
       12 . The electronic device according to  claim 1 , wherein the electronic device comprises a projector.  
   
   
       13 . The electronic device according to  claim 1 , wherein the conductive medium comprises a cooling pad.  
   
   
       14 . The electronic device according to  claim 1 , wherein the conductive medium comprises a cooling paste.