Solder comprising elemental powder

Abstract

Solders contain at least one agent for lowering the melting point, but these agents lead to a deterioration in the properties of the component to which the solder is applied. The solder according to the invention has a composition which is identical or similar to that of a solder according to the prior art, but in this case the elements which form a compound with the agent for lowering the melting point are at least partially added in powder form.

1 . A solder for repairing a nickel, cobalt or iron based super alloy component, comprising: 
 a base alloy made from a plurality of alloying elements; and    an agent that lowers the melting temperature of the solder and forms a foreign phase-forming alloying element in the solder during soldering or during use of the component wherein the foreign phase-forming alloying element in the solder is at least partially in the form of elemental metallic additional powder.    
     
     
         2 . The solder as claimed in  claim 1 , wherein the solder contains alloying elements selected from the group consisting of: chromium, aluminum, tantalum and tungsten.  
     
     
         3 . The solder as claimed in  claim 2 , wherein the solder comprises a single agent for lowering the melting point.  
     
     
         4 . The solder as claimed in  claim 3 , wherein the agent for lowering the melting point is boron.  
     
     
         5 . The solder as claimed in  claim 3 , wherein the solder includes two agents for lowering the melting point.  
     
     
         6 . The solder as claimed in  claim 3 , wherein the agent for lowering the melting point is silicon.  
     
     
         7 . The solder as claimed in  claim 1 , wherein the foreign phase-forming alloying element is tungsten or chromium.  
     
     
         8 . The solder as claimed in  claim 1 , wherein the foreign phase-forming alloying element is tungsten and chromium.  
     
     
         9 . The solder as claimed in  claim 1 , wherein the foreign phase-forming alloying element is from 1 to 4% by weight of tungsten or chromium in powder form.  
     
     
         10 . The solder as claimed in  claim 1 , wherein the foreign phase-forming alloying element is from 1 to 4% by weight of tungsten and chromium in powder form.  
     
     
         11 . The solder as claimed in  claim 1 , wherein the additional powder has a grain sizes of less than 500 nm.  
     
     
         12 . The solder as claimed in  claim 1   1 , wherein the additional powder has a grain sizes of less than 300 nm.  
     
     
         13 . The solder as claimed in  claim 12 , wherein the additional powder has a grain sizes of less than 100 nm.  
     
     
         14 . The solder as claimed in  claim 11 , wherein in the foreign phase-forming alloying element in powder form is added to a solder having the composition Me1Me2 Y Me3 Z Me4 w  wherein Me is an alloying element.  
     
     
         15 . The solder as claimed in  claim 14 , wherein the solder stoichiometry is restored to an initial solder stoichiometry by the addition of the at least one foreign phase-forming alloying element in powder form.  
     
     
         16 . The solder as claimed in  claim 15 , wherein the alloyed base material of the solder is in powder form.  
     
     
         17 . The solder as claimed in  claim 1 , wherein the solder consists essentially of: 
 23% by weight of chromium,    3.5% by weight of tantalum,    10% by weight of nickel,    7.0% by weight of tungsten,    0.5% by weight of zirconium,    0.2% by weight of titanium,    0.1% by weight of manganese,    0.4% by weight of silicon,    0.6% by weight of carbon,    3.0% by weight of boron,    1.5% by weight of iron, and    remainder cobalt.    
     
     
         18 . The solder as claimed in  claim 1 , wherein the solder consists essentially of: 
 20% by weight of chromium,    20% by weight of cobalt,    3% by weight of boron,    3% by weight of tantalum, and    remainder nickel.    
     
     
         19 . The solder as claimed in  claim 1 , wherein the solder consists essentially of: 
 14% by weight of chromium,    10% by weight of cobalt,    2.7% by weight of boron,    2.5% by weight of tantalum,    3.5% by weight of aluminum, and    remainder nickel.    
     
     
         20 . The solder as claimed in  claim 1 , wherein the solder consists essentially of: 
 21% by weight of nickel,    22% by weight of chromium,    2% by weight of boron,    3.5% by weight of tantalum; and    remainder cobalt.