Thick-film sheet member, devices to which the sheet member is applied, and methods of producing the sheet member and the devices

Abstract

A thick-film sheet member provided by a thick film which has a predetermined thickness and a predetermined thickness and a predetermined plan configuration, without the thick film being fixed to a substrate. This thick-film sheet member can be produced by (a) forming a paste film having a predetermined thickness, on a predetermined film formation surface in a predetermined pattern, and (b) peeling the paste film from the predetermined film formation surface after subjecting the paste film to a firing treatment effected at a predetermined temperature. The paste film is constituted by a thick-film material in the form of particles which are bonded together with a resin and which are sintered at the predetermined temperature.

1 . A thick-film sheet member, characterized by being provided by a thick film which has a predetermined thickness and a predetermined plan configuration, without said thick film being fixed to a substrate.  
   
   
       2 . A thick-film sheet member according to  claim 1 , produced by forming a paste film having a predetermined thickness, on a predetermined film formation surface in a predetermined pattern, and peeling said paste film from said predetermined film formation surface after subjecting said paste film to a firing treatment effected at a predetermined first temperature, wherein said paste film is constituted by a thick-film material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature.  
   
   
       3 . A thick-film sheet member, characterized by including: 
 a dielectric core body provided by a thin-plate-like thick-film dielectric body having a predetermined thickness;    a thick-film conductive body disposed on a surface of a part of said dielectric core body; and    a boundary-portion-reinforcing dielectric body constituted by a thick-film dielectric material, and disposed on said surface of said dielectric core body, with such a configuration thereof that permits said boundary-portion-reinforcing dielectric body to continuously extend and straddle a boundary between said dielectric core body and said thick-film conductive body.    
   
   
       4 . A thick-film sheet member according to  claim 3 , including a peripheral-portion-reinforcing dielectric body constituted by a thick-film dielectric material, and disposed on a surface of a part of a peripheral portion of said dielectric core body, in which part said thick-film conductive body is not disposed, such that said peripheral-portion-reinforcing dielectric body is contiguous to said boundary-portion-reinforcing dielectric body.  
   
   
       5 . A thick-film sheet member according to  claim 3 , wherein said material of said boundary-portion-reinforcing dielectric body has a softening point which is not higher than that of a material constituting said dielectric core body.  
   
   
       6 . A cold-cathode display device including: a plurality of emitters disposed on a first substrate; a plurality of anodes disposed on a second substrate parallel with said first substrate, so as to be opposed to said plurality of emitters; and a plurality of gate electrodes disposed in a position between said emitters and anodes and having a plurality of through-holes, so that electrons flowing from said emitters toward said anodes pass through said through-holes, whereby fluorescent layers fixed to surfaces of respective anodes are activated by said electrons, to emit light, said display device being characterized by including: 
 a thick-film sheet member having a thick-film dielectric layer having said through-holes, and a plurality of thick-film conductive layers disposed on said thick-film dielectric layer and electrically independent of each other, so as to constitute said gate electrodes.    
   
   
       7 . A cold-cathode display device according to  claim 6 , wherein said thick-film sheet member is fixed to said first substrate through a plurality of spherical bodies having predetermined particle sizes.  
   
   
       8 . A method of producing a cold-cathode display device in which fluorescent layers are activated by electrons which flow from a plurality of emitters disposed on a first substrate, toward a plurality of anodes disposed on a second substrate so that said fluorescent layers fixed to surfaces of said anodes are activated by the electrons, to emit light, said method including a step of parallelly superposing said first and second substrates on each other while positioning a plurality of gate electrodes, which have a plurality of through-holes permitting the flowing electrons to pass therethrough, between said first and second substrates, and a step of fixing said first and second substrates to each other, 
 said method being characterized by including a thick-film-sheet-member fixing step of fixing a thick-film sheet member onto one of said first substrate provided with said emitters and said second substrate provided with said anodes, said thick-film sheet member having a thick-film dielectric layer having said through-holes, and a plurality of thick-film conductive layers disposed on said thick-film dielectric layer and electrically independent of each other, so as to constitute said gate electrodes.    
   
   
       9 . A method according to  claim 8 , wherein said thick-film sheet member is produced by a process which includes: 
 a support-body preparing step of preparing a support body having a film formation surface provided by a high-melting-point, particle layer which is constituted by particles held together with a resin, said particles having a melting point higher than a predetermined first temperature;    a dielectric-paste-film forming step of forming a dielectric paste film on said film formation surface in a predetermined pattern corresponding to said thick-film dielectric layer, said dielectric paste film being constituted by a thick-film dielectric material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature;    a conductive-paste-film forming step of forming a conductive paste film on a surface of said dielectric paste film in a predetermined pattern which defines a plurality of sections corresponding to said plurality of thick-film conductive layers, said conductive paste film being constituted by a thick-film conductive material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature; and    a firing step of subjecting said support body on which said dielectric paste film and said conductive paste film have been formed, to a heat treatment effected at said predetermined first temperature, so that said dielectric paste film and said conductive paste film are sintered without said high-melting-point particle layer being sintered, whereby said thick-film dielectric layer is formed from said dielectric paste film while said thick-film conductive layers are formed from said conductive paste film.    
   
   
       10 . A method according to  claim 9 , wherein said support-body preparing step is implemented to form said high-melting-point particle layer on a surface of a predetermined substrate.  
   
   
       11 . A method according to  claim 10 , wherein said substrate is provided by a member which is not deformed at said first temperature.  
   
   
       12 . A method according to  claim 10 , including: 
 a connection-paste-film forming step of forming a connection paste film on a portion of the dielectric paste film on which portion said conductive paste film is not disposed, said connection paste film being constituted by a resin, spherical bodies which have predetermined particle sizes and inorganic material particles which are sintered at said predetermined first temperature, wherein said spherical bodies and said inorganic material particles are dispersed in said resin; and    a superposing step of superposing said support body on which said dielectric paste film, conductive paste film and connection paste film are disposed, onto said first substrate on which said emitters are disposed,    wherein said sintering step is implemented to sinter said connection paste film concurrently with said dielectric paste film and said conductive paste film, whereby said thick-film sheet member and said first substrate are connected by a connection layer which is formed of the sintered connection paste film.    
   
   
       13 . A method according to  claim 9 , wherein said paste-film forming steps are implemented to form said dielectric paste film and said conductive paste film by using a thick-film screen printing method.  
   
   
       14 . A method according to  claim 8 , wherein said thick-film-sheet-member fixing step is implemented to fix said thick-film sheet member to said first substrate through a plurality of spherical bodies having predetermined particle sizes.  
   
   
       15 . A method according to  claim 14 , wherein at least one of mutually opposed surfaces of said first substrate and said thick-film sheet member has a recess located in a fixing portion thereof in which said first substrate and said thick-film sheet member are fixed to each other with said spherical bodies interposed therebetween, so that an adhesive for fixing said first substrate and said thick-film sheet member is accommodated in said recess.  
   
   
       16 . A method of producing an inorganic EL device which has a luminous layer constituted by an inorganic material, a first dielectric layer provided by a translucent layer disposed on one of opposite surfaces of said luminous layer, a second dielectric layer disposed on the other of said opposite surfaces of said luminous layer, a first electrode layer disposed on a surface of said first dielectric layer, and a second electrode layer disposed on a surface of said second dielectric layer, so that light generated by said luminous layer with application of electric current between said first and second electrode layers, is seen through said first dielectric layer, said method being characterized by including: 
 a thick-film-sheet-member preparing step of preparing, a thick-film sheet member provided by a thick-film dielectric body for constituting said second dielectric layer;    an one-side-surface film forming step of disposing said second electrode layer on one of opposite surfaces of said thick-film sheet member; and    an other-side-surface film forming step of sequentially disposing said luminous layer, said first dielectric layer and said first electrode layer on the other of said opposite surfaces of said thick-film sheet member.    
   
   
       17 . A method according to  claim 16 , wherein said thick-film-sheet-member preparing step includes: 
 a support-body preparing step of preparing a support body having a film formation surface provided by a high-melting-point particle layer which is constituted by particles held together with a resin, said particles having a melting point higher than a predetermined first temperature;    a dielectric-paste-film forming step of forming a dielectric paste film on said film formation surface, said dielectric paste film being constituted by a thick-film dielectric material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature; and    a firing step of subjecting said support body to a heat treatment effected at said predetermined first temperature, so that said dielectric paste film is sintered without said high-melting-point particle layer being sintered, whereby said thick-film dielectric body is formed from said dielectric paste film.    
   
   
       18 . A method according to  claim 16 , wherein said one-side-surface film forming step includes: 
 a second-electrode-layer forming step of forming said second electrode layer on a predetermined substrate; and    a fixing step of superposing said substrate and said thick-film sheet member on each other such that said second electrode layer is located on one of opposite sides of said substrate closer to said thick-film sheet member, and subjecting the superposed substrate and thick-film sheet member to a heat treatment effected at a predetermined second temperature, so that said second electrode layer and said thick-film sheet member react with each other, for thereby fixing said substrate and said thick-film sheet member to each other.    
   
   
       19 . A method according to  claim 18 , wherein said second-electrode-layer forming step is implemented to apply a thick-film conductive paste on said substrate in a predetermined pattern, and subjecting said thick-film conductive paste to a firing treatment effected at a predetermined third temperature, so as to form said second electrode layer.  
   
   
       20 . A method of producing an inorganic EL device which has a luminous layer constituted by an inorganic material, a first dielectric layer provided by a translucent layer disposed on one of opposite surfaces of said luminous layer, a second dielectric layer disposed on the other of said opposite surfaces of said luminous layer, a first electrode layer disposed on a surface of said first dielectric layer, and a second electrode layer disposed on a surface of said second dielectric layer, so that light generated by said luminous layer with application of electric current between said first and second electrode layers, is seen through said first dielectric layer, said method being characterized by including: 
 a thick-film-sheet-member preparing step of preparing a thick-film sheet member which is provided by a thick-film dielectric body and a thick-film conductive body for constituting said second dielectric layer and said second electrode layer, respectively, wherein said thick-film conductive body is fixed to one of opposite surfaces of said thick-film dielectric body; and    an other-side-surface film forming step of sequentially disposing said luminous layer, said first dielectric layer and said first electrode layer on the other of said opposite surfaces of said thick-film sheet member.    
   
   
       21 . A method according to  claim 20 , wherein said thick-film-sheet-member preparing step includes: 
 a support-body preparing step of preparing a support body having a film formation surface provided by a high-melting-point particle layer which is constituted by particles held together with a resin, said particles having a melting point higher than a predetermined first temperature;    a conductive-paste-film forming step of forming a conductive paste film on said film formation surface in a predetermined pattern, said conductive paste film being constituted by a thick-film conductive material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature;    a dielectric-paste-film forming step of forming a dielectric paste film on said film formation surface such that said conductive paste film is covered with said dielectric paste film, said dielectric paste film being constituted by a thick-film dielectric material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature; and    a firing step of subjecting said support body to a firing treatment effected at said predetermined first temperature, so that said conductive paste film and said dielectric paste film are sintered without said high-melting-point particle layer being sintered, whereby said thick-film conductive body and said thick-film dielectric body are formed from said conductive paste film and said dielectric paste film, respectively, so that said thick-film sheet member is obtained.    
   
   
       22 . A method according to  claim 20 , wherein said thick-film-sheet-member preparing step includes: 
 an unfired-sheet preparing step of preparing an unfired ceramic sheet constituted by a dielectric material which is sintered at a predetermined first temperature;    a support-body preparing step of preparing a support body having a film formation surface provided by a high-melting-point particle layer which is constituted by particles held together with a resin, said particles having a melting point higher than said predetermined first temperature;    a conductive-paste-film forming step of forming a conductive paste film on said film formation surface in a predetermined pattern, said conductive paste film being constituted by a thick-film conductive material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature; and    a firing step of mounting said unfired ceramic sheet onto said conductive paste film, and subjecting said unfired ceramic sheet and said conductive paste film to a firing treatment effected at said predetermined first temperature, whereby said thick-film conductive body and said thick-film dielectric body are formed from said conductive paste film and said unfired ceramic sheet, respectively, and said thick-film conductive body is fixed to a surface of said thick-film dielectric body, without said high-melting-point particle layer being sintered, so that said thick-film sheet member is obtained.    
   
   
       23 . A method according to  claim 17 , wherein said support-body preparing step is implemented to form said high-melting-point particle layer on a surface of a predetermined substrate.  
   
   
       24 . A method according to  claim 23 , wherein said substrate is provided by a member which is not deformed at said first temperature.  
   
   
       25 . A method according to  claim 16 , wherein said other-side-surface film forming step is implemented to sequentially form said luminous layer, said first dielectric layer and said first electrode layer, by using a thin-film forming technique.  
   
   
       26 . A fluorescent display tube including: a plurality of fluorescent layers which are fixed to respective anodes disposed on a display surface of a substrate; a filament cathode which is disposed above said fluorescent layers; and a plurality of control electrodes which are disposed in a height position between said fluorescent layers and said cathode, so that electrons generated from said filament cathode are controlled by said control electrodes, to strike selected at least one of said fluorescent layers, whereby said selected at least one of said fluorescent layers is activated to emit light, said fluorescent display tube being characterized by including: 
 a thick-film sheet member which is fixed to said display surface of said substrate, and which has a thin-plate-shaped thick-film dielectric body and a plurality of thick-film conductive electrodes,    wherein said thick-film dielectric body has a predetermined thickness and a plurality of opening portions each of which is positioned in a position located above a corresponding one of said fluorescent layers and has such a size that permits an entirety of the corresponding fluorescent layer to be seen through each of said opening portions,    and wherein each of said thick-film conductive electrodes is fixed to a surface of said thick-film dielectric body, and extends along a periphery of a corresponding one of said opening portions, so as to constitute a corresponding one of said control electrodes.    
   
   
       27 . A fluorescent display tube according to  claim 26 , wherein said thick-film sheet member is fixed to said display surface of said substrate through a plurality of spherical bodies having predetermined particle sizes.  
   
   
       28 . A fluorescent display tube according to  claim 26 , including thick-film conductive wires which are connected to said thick-film conductive electrodes and which includes at least one of a first conductive wire and a second conductive wire, 
 wherein said first conductive wire is disposed inside said thick-film sheet member, while said second conductive wire is disposed on a surface of said thick-film sheet member facing said display surface.    
   
   
       29 . A fluorescent display tube according to  claim 26 , including a negative electrode which is constituted by a thick-film conductive material and which is given the same electric potential as said filament cathode, 
 wherein said negative electrode is disposed on a surface of said thick-film sheet member facing said filament cathode such that said negative electrode is located in a portion of said surface of said thick-film sheet member in which said thick-film conductive electrodes, are not disposed.    
   
   
       30 . A fluorescent display tube according to  claim 26 , including an anode and a fluorescent layer which is fixed to said anode, wherein said anode and said fluorescent layer are disposed on another surface of said thick-film sheet member.  
   
   
       31 . A method of producing a fluorescent display tube in which electrons generated from a filament cathode are controlled by a plurality of control electrodes, to strike selected at least one of a plurality of fluorescent layers, whereby said at least one of said fluorescent layers is activated to emit light, said method including a step of disposing a plurality of anodes on a display surface of a substrate, a step of fixing said plurality of fluorescent layers onto the respective anodes, a step of disposing said plurality of control electrodes above said plurality of fluorescent layers, and a step of disposing said filament cathode above said control electrodes, said method being characterized by including: 
 a thick-film-sheet-member fixing step of fixing a thick-film sheet member which has a thin-plate-shaped thick-film dielectric body and a plurality of thick-film conductive electrodes, to said display surface of said substrate, wherein said thick-film dielectric body has a predetermined thickness and a plurality of opening portions each of which has such a size that permits an entirety of a corresponding one of said fluorescent layers to be seen through each of said opening portions, wherein each of said thick-film conductive electrodes is fixed to a surface of said thick-film dielectric body, and extends along a periphery of a corresponding one of said opening portions, so as to constitute a corresponding one of said control electrodes, and wherein said thick-film sheet member is fixed to said display surface of said substrate such that each of said plurality of opening portions is positioned in a, position located, above a corresponding one of said fluorescent layers.    
   
   
       32 . A method according to  claim 31 , wherein said thick-film sheet member is produced by a process which includes: 
 a support-body preparing step of preparing a support body having a film formation surface provided by a high-melting-point particle, layer which is constituted by particles held together with a resin, said particles having a melting point higher than a predetermined first temperature;    a dielectric-paste-film forming step of forming a dielectric paste film on said film formation surface in a predetermined pattern corresponding to said thin-plate-shaped thick-film dielectric body, said dielectric paste film being constituted by a thick-film dielectric material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature;    a conductive-paste-film forming step of forming a conductive paste film on said film formation surface in a predetermined pattern corresponding to said thick-film conductive electrodes, said conductive paste film being constituted by a thick-film conductive material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature; and    a firing step of subjecting said support body to a heat treatment effected at said predetermined first temperature, so that said dielectric paste film and said conductive paste film are sintered without said high-melting-point particle layer being sintered, whereby said thin-plate-shaped thick-film dielectric body and said thick-film conductive electrodes are formed.    
   
   
       33 . A method according to  claim 32 , wherein said support-body preparing step is implemented to form said high-melting-point particle layer on a surface of a predetermined substrate which is used for producing a thick-film sheet member.  
   
   
       34 . A method according to  claim 33 , wherein said substrate is provided by a member which is not deformed at said first temperature.  
   
   
       35 . A method according to  claim 32 , wherein said conductive paste film and said dielectric paste film are formed by using a thick-film screen printing method.  
   
   
       36 . A thin CRT including: an electron source; a plurality of first electrodes extending along a predetermined direction; a plurality of second electrodes extending along another direction crossing said predetermined direction; and a fluorescent surface on which a predetermined fluorescent layer is disposed, and defining a vacuum space in which electrons generated from said electron source are controlled by said first and second electrodes, so that said electrons passing through said second, electrodes are permitted to strike a desired portion of said fluorescent surface, whereby said fluorescent layer emits light which is seen through said fluorescent surface, 
 said thin CRT being characterized by including a thick-film sheet member which has:    a dielectric support layer provided by a thick-film dielectric body having a multiplicity of electron passing-through holes; and    a thick-film conductive layer provided by a plurality of conductive films which are elongated along said another direction and are disposed on a surface of said dielectric support layer, for constituting said second electrodes,    wherein said thick-film sheet member is disposed between said first electrodes and said fluorescent surface, such that said thick-film sheet member is parallel with said fluorescent surface.    
   
   
       37 . A thin CRT according to  claim 36 , including a second thick-film sheet member in addition to said thick-film sheet member as a first thick-film sheet member, said second thick-film sheet member having: 
 a dielectric support layer provided by a thick-film dielectric body having a multiplicity of electron passing-through holes; and    a thick-film conductive layer provided by a plurality of conductive films which are elongated along said, predetermined direction and are disposed on a surface of said dielectric support layer, for constituting said first electrodes,    wherein said second thick-film sheet member is disposed between said electron source and said thick-film sheet member, such that said second thick-film sheet member is parallel with said thick-film sheet member.    
   
   
       38 . A method of producing a thin CRT including an electron source; a plurality of first electrodes extending along a predetermined direction; a plurality of second electrodes extending along another direction crossing said predetermined direction; and a fluorescent surface on which a predetermined fluorescent layer is disposed, and defining a vacuum space, in which electrons generated from said electron source are controlled by said first and second electrodes, so that said electrons passing through said second electrodes are permitted to strike a desired portion of said fluorescent surface, whereby said fluorescent layer emits light which is seen through said fluorescent surface, 
 said method being characterized by including a thick-film-sheet-member fixing step of fixing a thick-film sheet member between said first electrodes and said fluorescent surface, such that said thick-film sheet member is parallel with said fluorescent surface, said thick-film sheet member having:    a dielectric support layer provided by a thick-film dielectric body having a multiplicity of electron passing-through holes; and    a thick-film conductive layer provided by a plurality of conductive films which are elongated along said another direction and are disposed on a surface of said dielectric support layer, for constituting said second electrodes.    
   
   
       39 . A method according to  claim 38 , including a step of fixing a second thick-film sheet member between said electron source and said thick-film sheet member as a first thick-film sheet member, such that said second thick-film sheet member is parallel with said first thick-film sheet member, said second thick-film sheet member having: 
 a dielectric support layer provided by a thick-film dielectric body having a multiplicity of electron passing-through holes; and    a thick-film conductive layer provided by a plurality of conductive layers which are elongated along said predetermined direction and are disposed on a surface of said dielectric support layer, for constituting said first electrodes.    
   
   
       40 . A method according to  claim 38 , wherein said thick-film sheet member is produced by a process which includes: 
 a support-body preparing step of preparing a support body having a film formation surface provided by a high-melting-point particle layer which is constituted by particles held together with a resin, said particles having a melting point higher than a predetermined first temperature;    a dielectric-paste-film forming step of forming a dielectric paste film on said film formation surface in a predetermined pattern corresponding to said dielectric support layer, said dielectric paste film being constituted by a thick-film dielectric material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature;    a conductive-paste-film forming step of forming a conductive paste film on said film formation surface in a predetermined pattern which defines a plurality of sections corresponding to said conductive films of said thick-film conductive layer, said conductive paste film being constituted by a thick-film conductive material in the form of particles which are bonded together with a resin and which are sintered at said predetermined first temperature; and    a firing step of subjecting said support body to a heat treatment effected at said predetermined first temperature, so that said dielectric paste film and said conductive paste film are sintered without said high-melting-point particle layer being sintered, whereby said dielectric support layer and said thick-film conductive layer are formed of the sintered dielectric paste film and conductive paste film, respectively.    
   
   
       41 . A method according to  claim 40 , wherein said support-body preparing step is implemented to form said high-melting-point particle layer on a surface of a predetermined substrate.  
   
   
       42 . A method according to  claim 41 , wherein said substrate is provided by a member which is not deformed at said first temperature.  
   
   
       43 . A method according to  claim 40 , wherein said dielectric paste film and said conductive paste film are formed by using a thick-film screen printing method.