Fixing carrier, fixing carrier manufacturing method, method of using fixing carriers and substrate storage container

Abstract

An object is to provide a fixing carrier, a fixing carrier manufacturing method, a method of using the fixing carrier and a substrate storage container, which provide proper shipment of items to be loaded that are prone to warp and crack. A base 2 having rigidity is hollowed on its surface and formed with a sectioned space 3 laminated and covered by a supporting layer 8 that supports semiconductor wafer W, multiple projections 4 that are formed in the sectioned space and supports supporting layer 8 in contact therewith and an exhaust passage 6 that is bored through base 2 and draws air out of sectioned space 3 covered by supporting layer 8. Since semiconductor wafer W that is prone to warp and crack is supported by supporting layer 8 of a fixing carrier 1 and accommodated in the container body of a substrate storage container, instead of being kept directly in the container, so it is possible to achieve safe and proper shipment between factories.

1 . A fixing carrier wherein a deformable supporting layer that removably supports an item to be loaded is laid over a base, comprising: 
 a sectioned space formed in the base and covered by the supporting layer;    a projection provided in the sectioned space and supporting the supporting layer in contact therewith; and    an exhaust passage for drawing air out of the sectioned space that is formed in the base and covered by the supporting layer.    
   
   
       2 . The fixing carrier according to  claim 1 , wherein the base is formed of a flat plate having rigidity and an approximately circular shape, viewed from top while the supporting layer is formed of elastomer.  
   
   
       3 . The fixing carrier according to  claim 1 , wherein at least part of the deforming area of the supporting layer is processed with non-stick treatment.  
   
   
       4 . The fixing carrier according to  claim 3 , wherein the deforming area of the supporting layer is the surface of a non-contact portion where the supporting layer is not in contact with the projection.  
   
   
       5 . The fixing carrier according to  claim 1 , wherein the obverse surface at a contact portion where the supporting layer is in contact with the projection is formed to be a non-sticky surface.  
   
   
       6 . The fixing carrier according to  claim 1 , wherein the item to be loaded is a semiconductor wafer that has been background.  
   
   
       7 . The fixing carrier according to  claim 1 , wherein the projection is as high as 0.05 mm or higher.  
   
   
       8 . The fixing carrier according to  claim 1 , wherein multiple projections are provided so as to create clearance between projections.  
   
   
       9 . The fixing carrier according to  claim 1 , further including a negative pressure source that is connected to the exhaust passage and draws air out of the sectioned space so as to deform the supporting layer.  
   
   
       10 . A fixing carrier manufacturing method for manufacturing the fixing carrier defined in  claim 1 , comprising the steps of: 
 placing a concavo-convex surface of a stamper into contact with a thermoplastic resin sheet to heat and press it; and    cooling the sheet while pressing it so as to form at least projection(s), among the base, sectioned space, projection(s) and exhaust passage.    
   
   
       11 . The fixing carrier manufacturing method according to  claim 10 , wherein the resin sheet is heated and pressed at a temperature ranging from the glass transition temperature of the resin to 50° C. greater than that and cooled at a temperature lower by 20° C. or more than the glass transition temperature.  
   
   
       12 . A method of using a fixing carrier characterized in that an item to be loaded is transported using a fixing carrier defined in  claim 1 .  
   
   
       13 . A substrate storage container for accommodating fixing carriers defined in  claim 1 , comprising: 
 a front-open container body for accommodating fixing carriers;    a door element which opens and closes the front face of the container body; and    teeth for supporting fixing carriers formed on the walls on both sides of the container body.    
   
   
       14 . The substrate storage container according to  claim 13 , wherein each tooth is comprised of a flat plate that is provided on the side wall of the container body so as to extend along the side periphery of the fixing carrier, a front medium-thick area that is formed at the front interior side of the flat plate and supports the fixing carrier; and a rear medium-thick area that is formed in the rear part of the flat plate and supports the fixing carrier.