Heat-dissipation device and electronic apparatus utilizing the same

Abstract

An electronic apparatus and a heat-dissipation device thereof. The electronic apparatus includes a plate and the heat-dissipation device. The plate includes a first component and a second component thereon. The heat-dissipation device is adjacent to the plate, and includes a first sensor, a first cooling component, a second sensor, and a second cooling component thereon. The first sensor measures the temperature of the plate around the first component. The first cooling component is coupled to the first sensor to adjust the temperature of the plate around the first component. The second sensor measures the temperature of the plate around the second component. The second cooling component is coupled to the second sensor to adjust the temperature of the plate around the second component.

1 . An electronic apparatus comprising: 
 a plate comprising a first component and a second component; and    a heat-dissipation device, disposed adjacent to the plate, comprising a first sensor, a first cooling component, a second sensor, and a second cooling component, wherein the first a sensor measures the temperature of the plate around the first component, the first cooling component is coupled to the first sensor to adjust the temperature of the plate around the first component, the second sensor measures the temperature of the plate around the second component, and the second cooling component is coupled to the second sensor to adjust the temperature of the plate around the second component.    
   
   
       2 . The electronic apparatus as claimed in  claim 1 , wherein the electronic apparatus is a projector, and the plate is a ballast.  
   
   
       3 . The electronic apparatus as claimed in  claim 1 , wherein each of the first cooling component and the second cooling component is a thermoelectric cooling chip respectively.  
   
   
       4 . The electronic apparatus as claimed in  claim 1 , wherein each of the first cooling component and the second cooling component is a miniature fan respectively.  
   
   
       5 . The electronic apparatus as claimed in  claim 1 , wherein each of the first cooling component and the second cooling component is a miniature heat-dissipation module respectively.  
   
   
       6 . A heat-dissipation device comprising: 
 a body comprising a plurality of adjacent zones;    a plurality of sensors disposed in the zones respectively; and    a plurality of cooling components disposed in the zones respectively and coupled to the corresponding sensor that is located in the same zone.    
   
   
       7 . The heat-dissipation device as claimed in  claim 6 , wherein each cooling component is a thermoelectric cooling chip.  
   
   
       8 . The heat-dissipation device as claimed in  claim 6 , wherein each cooling component is a miniature fan.  
   
   
       9 . The heat-dissipation device as claimed in  claim 6 , wherein each cooling component is a miniature heat-dissipation module.  
   
   
       10 . An electronic apparatus comprising: 
 a plate;    a first component disposed on the plate;    a second component disposed on the plate;    a first sensor, disposed on the plate, corresponding to the first component to measure the temperature of the plate around the first component;    a first cooling component, disposed on the plate and coupled to the first sensor, corresponding to the first component to adjust the temperature of the plate around the first component;    a second sensor, disposed on the plate, corresponding to the second component to measure the temperature of the plate around the second component; and    a second cooling component, disposed on the plate and coupled to the second sensor, corresponding to the second component to adjust the temperature of the plate around the second component.    
   
   
       11 . The electronic apparatus as claimed in  claim 10 , wherein each of the first cooling component and the second cooling component is a thermoelectric cooling chip respectively.  
   
   
       12 . The electronic apparatus as claimed in  claim 10 , wherein each, of the first cooling component and the second cooling component is a miniature fan respectively.  
   
   
       13 . The electronic apparatus as claimed in  claim 10 , wherein each of the first cooling component and the second cooling component is a miniature heat-dissipation module respectively.