Method of making a circuitized substrate

Abstract

A circuitized substrate and a method of making the circuitized substrate are provided. The circuitized substrate includes a substrate having a conductive pad thereon. A first layer of solder enhancing material is positioned on the conductive pad, the first layer of solder enhancing material includes a first region and a second region positioned relative to the first region. A solder member is positioned on the first region of the first layer of solder enhancing material. A second layer of solder enhancing material is positioned on the solder member and on a portion of the second region of the first layer of solder enhancing material. The circuitized substrate may be used in the fabrication of an electronic package.

1 . A method of making a circuitized substrate comprising the steps of: 
 providing a substrate having at least one conductive pad thereon;    applying a first layer of solder enhancing material on said at least one conductive pad, said first layer of solder enhancing material including a first region and a second region positioned relative to said first region;    positioning a solder member on said first region of said first layer of solder enhancing material; and    applying a second layer of solder enhancing material on said solder member and on a portion of said second region of said first layer of solder enhancing material.    
   
   
       2 . The method of making the circuitized substrate of  claim 1  further including the step of heating said solder member, said at least one conductive pad, and said first and second layers of solder enhancing material to substantially clean said at least one conductive pad and said solder member with said first and second layers of solder enhancing material.  
   
   
       3 . A method of making a circuitized substrate comprising the steps of: 
 providing a substrate having at least one conductive pad thereon, said at least one conductive pad including a first portion and a second portion positioned adjacent said first portion;    applying a first layer of solder enhancing material on said first portion of said at least one conductive pad, said first layer of solder enhancing material including a first region and a second region positioned relative to said first region;    positioning a solder member on said first region of said first layer of solder enhancing material; and    applying a second layer of solder enhancing material on said solder member, on said second region of said first layer of solder enhancing material, and on said second portion of said at least one conductive pad.    
   
   
       4 . The method of making the circuitized substrate of  claim 3  further including the step of heating said solder member, said at least one conductive pad, and said first and second layers of solder enhancing material to substantially clean said at least one conductive pad and said solder member with said first and second layers of solder enhancing material.  
   
   
       5 . The method of  claim 1  wherein there are a plurality of conductive pads on said substrate and there are solder members associated with said pads in a ball grid array.  
   
   
       6 . The method of  claim 3  wherein there are a plurality of conductive pads on said substrate and there are solder members associated with said pads in a ball grid array.