US2006237832A1PendingUtilityA1

Standoffs for centralizing internals in packaging process

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Assignee: MICRON TECHNOLOGY INCPriority: Apr 25, 2002Filed: Jun 23, 2006Published: Oct 26, 2006
Est. expiryApr 25, 2022(expired)· nominal 20-yr term from priority
Inventors:Stephen JamesVernon Williams
H10W 90/754H10W 90/291H10W 90/288H10W 74/00H10W 72/9445H10W 72/07251H10W 72/07236H10W 72/07234H10W 72/951H10W 72/884H10W 72/877H10W 72/551H10W 72/253H10W 72/0198H10W 72/075H10W 72/59H10W 72/29H10W 72/20H10W 46/00H10W 90/811H10W 90/00H10W 74/129H10W 74/117H10W 74/016H10W 74/014H10W 40/778H10W 76/40
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Claims

Abstract

A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs disposed thereon. The standoffs can be brought into contact with an inner surface of the mold plates of a mold tooling when the device is positioned between the mold plates to maintain the flexible tape substrate in a centralized position within a mold chamber and inhibit the tape from bending as a molding compound flows into the chamber during encapsulation.

Claims

exact text as granted — not AI-modified
1 . A semiconductor device, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads thereon and a standoff attached to said surface, the standoff having a sufficient height and exposed on the die such that, upon positioning the device within a molding apparatus, the standoff is in contact with an inner surface of a mold plate of said apparatus.  
     
     
         2 . A semiconductor device, comprising a die having first and second surfaces, the first surface of the die adhesively mounted on a substrate, and the second surface of the die having bond pads thereon and a standoff attached to said surface, the standoff having a sufficient height and exposed on the die such that, upon positioning the device within a molding apparatus, the standoff is in contact with an inner surface of a mold plate of said apparatus.  
     
     
         3 . A semiconductor device, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads thereon and a plurality of standoffs attached to said surface, at least one standoff having a sufficient height and exposed on the die such that, upon positioning the device within a molding apparatus, said standoff is in contact with an inner surface of a mold plate of said apparatus.  
     
     
         4 . The device of  claim 3 , wherein the standoffs comprise screen printed, stenciled, or stamped structures on the second surface of the die.  
     
     
         5 . The device of  claim 3 , wherein the standoffs are adhesively mounted on the second surface of the die.  
     
     
         6 . The device of  claim 3 , wherein the bond pads of the die are electrically connected to bond pads on the substrate.  
     
     
         7 . A semiconductor package, comprising the device of  claim 6  being at least partially encapsulated.  
     
     
         8 . A semiconductor device, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads thereon and a plurality of standoffs attached to said surface, the standoffs comprising a non-conductive material, and at least one standoff having a sufficient height and exposed on the die such that, upon positioning the device within a molding apparatus, said standoff is in contact with an inner surface of a mold plate of said apparatus.  
     
     
         9 . A semiconductor device, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads thereon and a plurality of standoffs attached to said surface, the standoffs comprising a thermally conductive material, and at least one standoff having a sufficient height and exposed on the die such that, upon positioning the device within a molding apparatus, said standoff is in contact with an inner surface of a mold plate of said apparatus.  
     
     
         10 . The device of  claim 9 , wherein the thermally conductive material comprises a conductive metal.  
     
     
         11 . The device of  claim 9 , wherein the standoffs comprise electroplated structures.  
     
     
         12 . A semiconductor device, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads thereon with a thermally conductive material and an adjacently situated standoff attached to said second surface, the standoff comprising a non-thermally conductive material and having a sufficient height and exposed on the die such that, upon positioning the device within a molding apparatus, the standoff is in contact with an inner surface of a mold plate of said apparatus.  
     
     
         13 . A semiconductor device, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads thereon with a thermally conductive material and an adjacently situated standoff attached to said second surface, the standoff configured to encircle the thermally conductive material, the standoff comprising a non-thermally conductive material and having a sufficient height and exposed on the die such that, upon positioning the device within a molding apparatus, the standoff is in contact with an inner surface of a mold plate of said apparatus.  
     
     
         14 . A semiconductor device, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads with a heat sink and a standoff situated on said second surface, the standoff comprising a non-thermally conductive material and configured as a dam to encircle the heat sink, the standoff having a sufficient height and exposed on the die such that, upon positioning the device within a molding apparatus, the standoff is in contact with an inner surface of a mold plate of said apparatus.  
     
     
         15 . A semiconductor device, comprising a substrate having opposing surfaces and a die situated on each of said surfaces, each die having first and second surfaces, the first surface of the dies situated on the substrate, and the second surface of the dies having bond pads thereon and a standoff attached to said surface, the standoffs having a sufficient height and exposed on the dies such that when the device is positioned within a molding apparatus with the substrate secured between two molding plates of said molding apparatus, the standoffs are in contact with an inner surface of the molding plates.  
     
     
         16 . A semiconductor device, comprising a die having first and second surfaces, the first surface of the die mounted on a flexible substrate, and the second surface of the die having bond pads thereon and a standoff attached to said surface, the standoff having a sufficient height and exposed on the die such that when the device is positioned within a molding apparatus, the standoff is in contact with an inner surface of a molding plate of the molding apparatus and the substrate is in an about planar orientation.  
     
     
         17 . The device of  claim 16 , wherein the die is adhesively mounted on a flexible tape substrate.  
     
     
         18 . The device of  claim 17 , wherein the substrate is a polyimide tape.  
     
     
         19 . A semiconductor device, comprising a die having first and second surfaces, the first surface of the die mounted on a rigid substrate, and the second surface of the die having bond pads thereon and a standoff attached to said surface, the standoff having a sufficient height and exposed on the die to contact an inner surface of a molding plate of a molding apparatus when the device is positioned within said apparatus.  
     
     
         20 . The device of  claim 19 , wherein the die is mounted on a rigid substrate comprising a material from the group consisting of a polymer resin, ceramic, and metal clad fiber board.  
     
     
         21 . The device of  claim 19 , wherein the die is mounted on a metal leadframe.  
     
     
         22 . A molded die package, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads thereon and a standoff attached to said surface, and a molding compound over at least the second surface of the die and at least a portion of the standoff to form the molded die package, the standoff being at least partially exposed through the molded package.  
     
     
         23 . An electrical device, comprising the die package of  claim 22 .  
     
     
         24 . A molded die package, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads thereon and a plurality of standoffs attached to said surface, and a molding compound over at least the second surface of the die and at least a portion of the standoffs to form the molded die package, the standoffs being at least partially exposed through the molded package.  
     
     
         25 . A molded die package, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads thereon and a plurality of standoffs attached to said surface, the standoffs comprising a non-conductive material, and a molding compound over at least the second surface of the die and at least a portion of the standoffs to form the molded die package, the standoffs being at least partially exposed through the molded package.  
     
     
         26 . An electrical apparatus, comprising the die package of  claim 25 .  
     
     
         27 . A molded die package, comprising a die having first and second surfaces, the first surface of the die situated on a substrate, and the second surface of the die having bond pads thereon and a plurality of standoffs attached to said surface, the standoffs comprising a thermally conductive material, and a molding compound over at least the second surface of the die and at least a portion of the standoffs to form the molded die package, the standoffs being at least partially exposed through the molded package.  
     
     
         28 . An electrical apparatus, comprising the die package of  claim 26.

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