Electroplating apparatus

Abstract

An electroplating apparatus is provided which includes a solution tank which has at least a bottom plate and a side plate and inside which electroplating solution is poured and a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank, in which one plate of the cathode plate and the anode plate is an object to be electroplated and placed in a lower position than the other plate, in which an opening through which the cathode plate and the anode plate are inserted into the solution tank is provided in the side plate of the solution tank, and in which a shield plate which is detachable shields the opening of the solution tank.

1 . An electroplating apparatus, comprising: 
 a solution tank which has at least a bottom plate and a side plate and inside which electroplating solution is poured; and    a cathode plate and an anode plate which are horizontally placed so as to face each other in the electroplating solution in the solution tank, wherein    one plate of the cathode plate and the anode plate is an object to be electroplated and placed in a lower position than the other plate, wherein    an opening through which the cathode plate and the anode plate are inserted into the solution tank is provided in the side plate of the solution tank, and wherein    a shield plate which is detachable shields the opening of the solution tank.    
   
   
       2 . An electroplating apparatus according to  claim 1 , wherein a slot which holds the cathode plate and/or the anode plate horizontally is provided in the side plate of the solution tank.  
   
   
       3 . An electroplating apparatus according to  claim 1 , wherein a plurality of slots which hold the cathode plate and/or the anode plate horizontally are vertically arranged in the side plate of the solution tank in order to adjust a height of the cathode plate and/or the anode plate.  
   
   
       4 . An electroplating apparatus according to  claim 3 , wherein the slots are used to adjust a height of the other plate, wherein 
 a conductive member which conducts electricity to the other plate is inserted downward from above toward inside of the solution tank into the other plate so as to be electrically connected to the other plate, and wherein    the conductive member is supported in the solution tank in such a manner that a height of the conductive member is adjustable corresponding to the height of the other plate.    
   
   
       5 . An electroplating apparatus according to  claim 4 , wherein the one plate is cantilevered and attached to the shield plate.  
   
   
       6 . An electroplating apparatus according to  claim 5 , wherein a conductive member which conducts electricity to the one plate passes through the shield plate horizontally toward inside of the solution tank so as to be electrically connected to the one plate.