Multi-channel temperature control system for semiconductor processing facilities

Abstract

A temperature control system for multiple process components is a semiconductor processing facility includes a common cooling unit for controlling the temperature of a cooling fluid and multiple remote temperature control modules in fluid communications with the common cooling unit that separately control the temperature of the multiple process components. The remote temperature control modules are located near the process components and each remote temperature control module includes a circulation loop for the cooling fluid from the common cooling unit and circulation loop for a heat transfer fluid that received from a process component. A heat exchanger within the remote temperature control module allows heat transfer between the heat transfer fluid and the cooling fluid, thereby cooling the process component. A heat source may also be include within the remote temperature control module to provide heat to the heat transfer fluid and to the process component.

1 - 25 . (canceled)  
   
   
       26 . A semiconductor processing facility temperature control system comprising: 
 a cooling unit which controls a temperature of a cooling fluid;    a plurality of temperature control modules in fluid communication with both the cooling unit and process components of a semiconductor processing facility where the plurality of temperature control modules are remotely located from the process components;    a cooling fluid circulation loop which circulates the cooling fluid through the plurality temperature control modules where the cooling fluid circulation loop is in fluid communication with the cooling unit;    a heat transfer fluid circulation loop which circulates a heat transfer fluid through both the plurality of temperature control modules and process components of the semiconductor processing facility, wherein each of the temperature control modules includes: 
 an integrated heat exchanger including: 
 a portion of the cooling fluid circulation loop;  
 a portion of the heat transfer fluid circulation loop;  
 a heat source, wherein the cooling fluid circulation loop portion is in thermal communication with the heat transfer fluid circulation loop portion such that heat exchange occurs between the cooling fluid the heat transfer fluid;  
 a current controller operatively coupled with the heat source;  
 a cooling fluid control valve in fluid communication with the cooling fluid circulation loop for controlling circulation of the cooling fluid through the cooling fluid circulation loop; and  
 a controller programmed with a temperature control logic for controlling the cooling fluid control valve and controlling the controller.  
 
   
   
   
       27 . The temperature control system of  claim 26 , wherein each of the temperature control modules includes the heat source in thermal communication with the heat transfer fluid for providing heat to the heat transfer fluid.  
   
   
       28 . The temperature control system of  claim 27 , wherein the heat source is controlled by the temperature control logic in response to temperature set point information and temperature feedback information related to each process components of the process components.  
   
   
       29 . The temperature control system of  claim 26 , wherein the cooling unit is physically separate from the plurality of temperature control modules.  
   
   
       30 . The temperature control system of  claim 29 , wherein the cooling unit is located in a utility basement of the semiconductor processing facility.  
   
   
       31 . The temperature control system of  claim 30 , wherein the plurality of temperature control modules are located in a subfloor area of the semiconductor processing facility.  
   
   
       32 . The temperature control system of  claim 26 , wherein each of the process components has a set point temperature where the cooling unit is set to maintain the cooling fluid at a temperature correlating to a lowest temperature among all the process components that are thermally influenced by said cooling fluid.  
   
   
       33 . The temperature control system of  claim 26 , wherein the cooling unit is set to maintain the cooling fluid at a temperature correlating to a lowest temperature of a temperature control module of the plurality of temperature control modules.  
   
   
       34 . A multi-channel semiconductor processing facility temperature control system comprising: 
 a cooling unit which controls a temperature of a cooling fluid;    a temperature control module fluidly coupled with both the cooling unit and a process component of a semiconductor processing facility, the temperature control module being operatively coupled with a process component temperature sensor;    a cooling fluid circulation loop which circulates the cooling fluid through the temperature control module where the cooling fluid circulation loop is in fluid communication with the cooling unit;    a heat transfer fluid circulation loop which circulates a heat transfer fluid through both the temperature control module and the process component, wherein the temperature control module includes: 
 an integrated heat exchanger including: 
 a portion of the cooling fluid circulation loop;  
 a portion of the heat transfer fluid circulation loop;  
 a heat source, wherein the cooling fluid circulation loop portion is in thermal communication with the heat transfer fluid circulation loop portion such that heat exchange occurs between the cooling fluid the heat transfer fluid;  
 a current controller operatively coupled with the heat source;  
 a cooling fluid control valve in fluid communication with the cooling fluid circulation loop for controlling the circulation of the cooling fluid through the cooling fluid circulation loop; and  
 a controller programmed with a temperature control logic for controlling the cooling fluid control valve and controlling the controller.  
 
   
   
   
       35 . The temperature control system of  claim 34 , wherein the temperature control module includes the heat source in thermal communication with the heat transfer fluid for providing heat to the heat transfer fluid.  
   
   
       36 . The temperature control system of  claim 35 , wherein the heat source is controlled by the temperature control logic in response to temperature set point information and temperature feedback information related to the process component.  
   
   
       37 . The temperature control system of  claim 34 , wherein the cooling unit is physically separate from the temperature control module.  
   
   
       38 . The temperature control system of  claim 37 , wherein the cooling unit is located in a utility basement of the semiconductor processing facility.  
   
   
       39 . The temperature control system of  claim 38 , wherein the temperature control module is located in a subfloor area of the semiconductor processing facility.  
   
   
       40 . The temperature control system of  claim 34 , wherein the process component has a set point temperature where the cooling unit is set to maintain the cooling fluid at a temperature correlating to the set point temperature.