Heat sink

Abstract

A heat sink including a main body and a plurality of porous structures is disclosed. The main body has a plurality of hollow fins and a base. The fins and the base form a closed room. The porous structures are set on the interior surfaces of different fins, and are connected to the base. Each porous structure defines a vapor chamber.

1 . A heat sink, comprising: 
 a main body having a plurality of hollow fins and a base, each fin having a close end and an open end facing the base, and the fins and the base forming a closed room; and    a plurality of porous structures comprising a plurality of conductive portions, connective portions and heat-absorptive portions, wherein the conductive portions are continuously formed on the interior surfaces of the hollow fins, the heat-absorptive portions are formed on the base, and each connective portion is set between the neighboring conductive portions and connected to the heat-absorptive portions on the base to divide the closed room into a plurality of vapor chambers, and each connective portion comprises a plurality of holes for allowing vaporized fluid to pass therethrough.    
   
   
       2 . The heat sink as described in  claim 1 , wherein the porous structures are wicks selected from the group consisting of a combination of one or more of mesh wicks, fiber wicks, sintered wicks, and groove wicks.  
   
   
       3 . The heat sink as described in  claim 1 , wherein the porous structures contain a fluid selected from the group consisting of a mixture of one or more of inorganic compounds, water, alcohols, liquid metals, ketones, refrigerants, and organic compounds.  
   
   
       4 . The heat sink as described in  claim 1 , wherein the material of the porous structures is selected from the group consisting of a mixture of one or more of plastics, metals, alloys, and porous non-metal materials.  
   
   
       5 . The heat sink as described in  claim 1 , wherein the fins and the base are formed by a method selected from the group consisting of a combination of one or more of soldering, engaging, embedding and adhering, or the main body is one-piece molded.  
   
   
       6 . The heat sink as described in  claim 1 , wherein the fins are arranged in a longitudinal, parallel, transverse, diagonal, or irregular array.  
   
   
       7 . The heat sink as described in  claim 1 , wherein neighboring vapor chambers are communicated with each other or in fluid communication through the porous structures.  
   
   
       8 . A heat dissipating device, comprising: 
 a main body having a plurality of hollow protrusions and a base, each protrusion having a close end and an open end facing the base, and the protrusions and the base forming a closed room; and    a plurality of porous structures comprising a plurality of conductive portions, connective portions and heat-absorptive portions, wherein the conductive portions are continuously formed on the interior surfaces of the hollow protrusions, the heat-absorptive portions are formed on the base, and each connective portion is set between the neighboring conductive portions and connected to the heat-absorptive portions on the base to divide the closed room into a plurality of vapor chambers, and each connective portion comprises a plurality of holes for allowing vaporized fluid to pass therethrough.    
   
   
       9 . The heat dissipating device as described in  claim 8 , wherein one of the protrusions has a fin shape, columnar shape, lamellar shape, conical shape, or lump shape.  
   
   
       10 . The heat dissipating device as described in  claim 8 , wherein the porous structures are wicks.  
   
   
       11 . The heat dissipating device as described in  claim 10 , wherein the wicks are selected from the group consisting of a combination of one or more of mesh wicks, fiber wicks, sintered wicks, and groove wicks.  
   
   
       12 . The heat dissipating device as described in  claim 8 , wherein the porous structures and the main body are assembled by sintering, adhering, filling, or depositing.  
   
   
       13 . The heat dissipating device as described in  claim 8 , wherein the porous structures contain a fluid selected from the group consisting of a mixture of one or more of inorganic compounds, water, alcohols, liquid metals, ketones, refrigerants, and organic compounds.  
   
   
       14 . The heat dissipating device as described in  claim 8 , wherein the material of the porous structures is selected from the group consisting of a mixture of one or more of plastics, metals, alloys, and porous non-metal materials.  
   
   
       15 . The heat dissipating device as described in  claim 8 , wherein the protrusions and the base are formed by soldering, engaging, embedding or adhering, or the main body is one-piece molded.  
   
   
       16 . The heat dissipating device as described in  claim 8 , wherein neighboring vapor chambers are communicated with each other, or in fluid communication through the porous structures.  
   
   
       17 . The heat dissipating device as described in  claim 8 , wherein the vapor chambers of the porous structures are arranged in the closed room in a longitudinal, parallel, transverse, diagonal, or irregular array.  
   
   
       18 . A heat sink, comprising: 
 a main body having a plurality of hollow fins and a base, the fins and the base forming a closed room; and    a plurality of porous structures continuously formed on the interior surfaces of the hollow fins and connected to the base, wherein the porous structures further comprise a plurality of connective portions, each connective portion is set between the porous structures on neighboring hollow fins and connected to the porous structures on the base to divide the closed room into a plurality of vapor chambers, and each connective portion comprises a plurality of holes for allowing vaporized fluid to pass therethrough.